Advanced Packaging Internship Program (Semiconductor Manufacturing)

Location: On-site in Kulim, Malaysia

Company

hirify.global is a semiconductor technology company with manufacturing and engineering operations.

What you will do

• Support equipment troubleshooting, maintenance, qualification, and improvement activities.
• Assist with process optimization and continuous improvement projects.
• Collect, analyze, and interpret manufacturing data for engineering decisions.
• Support design of experiments, data analysis, validation, laboratory experiments, and process evaluations.
• Conduct technical research and prepare reports, presentations, and documentation.
• Collaborate with cross-functional engineering and manufacturing teams.

Requirements

• Currently pursuing a bachelor's degree in Electrical and Electronic Engineering or a related engineering discipline.
• Compulsory industrial training or internship placement is required to satisfy academic requirements.
• Good written and verbal communication skills in English.
• Strong analytical and problem-solving skills, with the ability to work independently and in a team.
• Basic knowledge of semiconductor manufacturing, process engineering, or equipment engineering.
• Available for a minimum internship period of 3 to 6 months, subject to university requirements and the academic calendar.

Nice to have

• Proficiency in Microsoft Office, including Excel, PowerPoint, and Word.
• Familiarity with programming, database management such as SQL, data analytics tools, or engineering software.

Culture & Benefits

• Hands-on experience in a fast-paced manufacturing environment.
• Collaboration with engineers and cross-functional teams.
• Opportunity to contribute to projects affecting production goals and manufacturing methodologies.
• Shift 1 schedule in Malaysia.