2 часа назад
Staff/Sr Staff Product Package Engineer (Semiconductor)
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Staff/Sr Staff Product Package Engineer (Semiconductor): Sustaining power IC products through high-volume production by managing product lifecycles, assembly readiness, manufacturing issues, and package improvements with an accent on quality, reliability, manufacturability, and cost optimization. Focus on resolving cross-functional production issues, supporting qualifications and process migrations, and improving yield, test time, and process performance onsite in Bayan Lepas.
Location: Bayan Lepas, Malaysia; onsite work required
Company
A global embedded semiconductor solutions provider serving automotive, industrial, infrastructure, and IoT markets.
What you will do
- Own the lifecycle of multiple products after mass production and ensure long-term product continuity.
- Oversee assembly-line readiness and manufacturing execution for high-volume AI products across internal factories and subcontractors.
- Monitor and resolve manufacturing issues in collaboration with fab, assembly, test, quality, reliability, operations, and OSAT teams.
- Improve sustaining product COGS, yield, production volume, test time, and failure performance through process optimization.
- Manage MRB and PCRB risks while supporting product qualifications, second-source and material changes, and process migrations.
- Drive package design improvements, prevent quality excursions, and resolve customer issues.
Requirements
- At least 5 years of experience in package development and process engineering.
- Bachelor’s degree in mechanical engineering, electrical/electronic engineering, physics, materials science, or a related field.
- Experience executing product ramps, preparing bills of materials, planning equipment capacity, and optimizing manufacturing processes.
- Experience with package development or process engineering involving materials, processes, or product design.
- Experience with CuClip thin-die assembly and SPS solder-attach processes.
- Good verbal and written communication skills in English; onsite work in Bayan Lepas is required.
Nice to have
- Familiarity with JMP and PDF Exenso.
Culture & Benefits
- Collaborative work across design, test, manufacturing, package, quality, operations, and reliability functions.
- Culture built around transparency, agility, global collaboration, innovation, and entrepreneurship.
- Competitive benefits package alongside salary.
- Work connected to semiconductor technologies for automotive, industrial, infrastructure, and IoT applications.
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