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1 день назад

Dir, Packaging Eng (Semiconductor)

Формат работы
remote (только Taiwan)
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
Taiwan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Dir, Packaging Eng (Semiconductor): Managing semiconductor packaging production across OSAT partners with an accent on yield, supplier quality, production ramps, and capacity planning. Focus on leading corrective actions, sustaining high-volume manufacturing, resolving supply and capacity constraints, and coordinating cross-functional production readiness.

Location: Remote in Taiwan; successful candidates must provide proof of the right to work in Taiwan.

Company

hirify.global develops low-cost, low-power programmable logic solutions and programmable power management devices for global customers.

What you will do

  • Manage day-to-day semiconductor packaging production across multiple OSAT partners, including output, delivery, quality, capacity, and KPI reviews.
  • Own yield performance, monitor excursions, lead root-cause and corrective-action processes, and implement SPC-based improvement programs.
  • Support supplier quality activities, audits, non-conformance management, MRB/FRB reviews, and CAPA closure.
  • Lead new and transferred package ramps into high-volume production, including run-at-rate plans, readiness reviews, milestone tracking, and transition to stable production.
  • Coordinate material availability, OSAT capacity allocation, production scheduling, supply-risk mitigation, and demand-planning inputs.
  • Provide senior technical leadership and communicate production status, risks, and mitigation plans to internal stakeholders and senior leadership.

Requirements

  • Bachelor’s degree or higher in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related discipline.
  • 15+ years of experience in semiconductor packaging, with a strong focus on high-volume production and OSAT management.
  • Deep knowledge of assembly and test processes, including flip chip, BGA, WLP/FOWLP, QFN/QFP, and SiP.
  • Experience managing production yield, quality programs, supply continuity, and production ramps with OSAT partners.
  • Proficiency in CAPA, SPC, FMEA, 8D, MRB, and FRB methodologies.
  • Strong communication, escalation-management, and cross-functional collaboration skills across geographies and cultures.

Culture & Benefits

  • Work in an international organization focused on R&D, product innovation, and customer service.
  • Collaborate with engineers, designers, manufacturing operations, sales, marketing, and support teams.
  • Comprehensive compensation and benefits programs are provided.
  • Employment is subject to successful background and reference checks.

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