Intern, Process Engineering (Semiconductor Manufacturing)

Location: Bayan Lepas, Malaysia; onsite only

Company

hirify.global provides embedded semiconductor solutions for automotive, industrial, infrastructure, and IoT applications.

What you will do

• Learn the fundamentals of die attach and wire bond processes.
• Apply data analysis techniques, including Statistical Process Control, to identify product issues.
• Propose new process improvement projects based on manufacturing data.
• Collaborate with engineers and gain an understanding of the workflow from Front of Line to End of Line.

Requirements

• Bachelor’s degree in Materials, Mechanical, Manufacturing Engineering, or a related discipline.
• Exposure to programming languages such as C, C++, or Python through coursework or projects.

Culture & Benefits

• Opportunity to develop technical and business skills across product groups and corporate functions.
• Access to hardware and software capabilities and opportunities to explore new areas.
• Flexible and inclusive work environment with global support systems and Employee Resource Groups.
• Opportunity to contribute to semiconductor products and solutions for global customers.