Process Engineer (Semiconductor)

Location: Batu Kawan, Malaysia; onsite at the Penang SDSM Office in Seberang Perai

Company

hirify.global develops and manufactures Flash memory and advanced memory technology solutions through global manufacturing operations.

What you will do

• Lead production excursion investigations, coordinate cross-functional resolution, perform line audits, and follow up on issue closure.
• Manage product yield across assembly and test processes while monitoring performance and quality.
• Conduct commonality analysis across product design, process, equipment, materials, and measurements to identify root causes.
• Set up and continuously improve assembly processes, with a focus on die attach equipment.
• Conduct engineering DOEs, statistical analysis, risk assessments, simulations, and process optimization.
• Implement capacity, productivity, cost-reduction, compliance, and process-change improvements, documenting results for management.

Requirements

• Bachelor’s degree in Mechanical, Manufacturing, Electrical, Electronics, Industrial Engineering, or a related field.
• 5–7 years of experience in semiconductor, electronics, manufacturing, or high-volume production environments.
• Experience with process monitoring, statistical analysis, SPC, FMEA, CAPA, Control Plans, DOE, APC, and risk assessment.
• Experience in pre-assembly and assembly processes, including Die Attach, FC, and UF.
• Proficiency in statistical analysis and process simulation software, with strong data-driven decision-making and troubleshooting skills.
• Ability to work independently in a fast-paced manufacturing environment and coordinate effectively with cross-functional teams.

Culture & Benefits

• Full-time exempt position.
• Inclusive environment focused on diversity, belonging, respect, and contribution.
• Accessibility support is available throughout the application and hiring process.
• hirify.global operates advanced manufacturing facilities recognized for 4IR innovation and sustainability achievements.