Assembly Media and Collaterals Development Engineer (Semiconductor)

TL;DR

Assembly Media and Collaterals Development Engineer (Semiconductor): Developing assembly processes and equipment for next-generation packaging platform technologies with an accent on manufacturing efficiency, quality, and reliability. Focus on optimizing package production flows, applying DOE/SPC principles, and designing equipment to simulate field-use conditions.

Location: On-site in Kulim, Malaysia

Company

hirify.global Foundry specializes in state-of-the-art semiconductor manufacturing and advanced packaging technology to enable leadership products for the AI era.

What you will do

• Develop assembly processes and equipment for future packaging platform technologies.
• Optimize manufacturing efficiency to meet quality, reliability, cost, yield, and productivity requirements.
• Create process and equipment specifications using Design of Experiments (DOE) and data analysis.
• Design and maintain equipment to evaluate silicon and package technologies under simulated field-use conditions.
• Ensure manufacturability of physical package layouts and oversee the full manufacturing cycle.
• Collaborate with contract assemblers and raw material vendors to ensure strict adherence to specifications.

Requirements

• Bachelor's or Master's degree in Mechanical, Material, or Electrical Engineering, or Physics.
• Minimum 2+ years of experience in fundamental science and engineering concepts.
• Strong knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Proficiency in design tools such as AutoCAD and SolidWorks.
• Experience with engineering drawings and tolerancing analysis.
• Must be based in or be able to work on-site in Kulim, Malaysia.

Nice to have

• Advanced expertise in mechanical design software.
• Portfolio of completed concept-to-fabrication projects for assembly equipment.
• Deep understanding of semiconductor fabrication processes and technology.

Culture & Benefits

• Opportunity to work within a worldwide factory network.
• Engagement with cutting-edge technology for the AI era.
• Commitment to ethical hiring practices and RBA compliance.
• Professional environment focused on continuous improvement and technical innovation.