Assembly Media and Collaterals Development Engineer (Semiconductor)

Location: On-site in Kulim, Malaysia

Company

hirify.global Foundry develops semiconductor process and packaging technologies, with a focus on advanced packaging, manufacturing scale, supply chain, yield improvement, and final test and assembly.

What you will do

• Develop media and collaterals for assembly processes and equipment, applying innovative concepts to future assembly packaging platforms.
• Improve manufacturing efficiency, quality, reliability, cost, yield, productivity, and manufacturability.
• Create specifications using Design of Experiments and data analysis, and document improvements through technical white papers.
• Develop and maintain equipment for evaluating solutions under simulated heat, humidity, vibration, temperature-cycle, and dynamic-force conditions.
• Develop acceleration methods, tools, and quality screens for early identification of media and collateral quality and reliability issues.
• Lead design, material selection, prototype development, qualification standardization, and collaboration with packaging technology and partner engineering groups.

Requirements

• Bachelor’s or master’s degree in mechanical engineering, materials engineering, electrical engineering, physics, or a related field.
• At least 2 years of experience applying fundamental science and engineering concepts to develop novel solutions.
• Strong knowledge of Statistical Process Control and/or Design of Experiments principles.
• Experience with packaging-industry analytics and design tools such as SolidWorks and AutoCAD.
• Experience with engineering drawings, tolerancing analysis, and design rules.
• On-site presence in Kulim, Malaysia is required.

Nice to have

• Portfolio of concept-to-fabrication projects involving assembly equipment, processes, media, or collaterals.
• Experience delivering complex, time-critical technical projects.
• Understanding of semiconductor fabrication processes and technology.

Culture & Benefits

• Work within hirify.global Foundry’s worldwide factory network.
• Contribute to advanced packaging and semiconductor manufacturing technologies for the AI era.
• Work closely with packaging technology development and partner engineering groups.
• Day shift: Shift 1, Malaysia.
• Full-time experienced-hire position.