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4 дня назад

Mid-end and Backend Process Technology Engineer (WET/Integration/Metal Deposition/Lithography)

Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
Japan
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Mid-end and Backend Process Technology Engineer (WET/Integration/Metal Deposition/Lithography): Developing and industrializing semiconductor mid-end and backend processes for embedded power devices, including RDL, backside metal, ultra-thinning, and dicing, with an accent on process integration, materials, equipment, and production transition. Focus on building manufacturing processes, improving quality and yield, supporting mass production ramp-up, and reducing process costs.

Location: Kodaira, Tokyo, Japan. Hybrid work is available under the company model, with two remote-work days per week and office attendance from Tuesday through Thursday; role-specific remote work is otherwise listed as unavailable.

Company

hirify.global provides embedded semiconductor solutions for automotive, industrial, infrastructure, IoT, and high-performance computing applications.

What you will do

  • Develop mid-end and backend semiconductor processes for new products, including WET, integration, metal deposition, and lithography.
  • Build optimal process flows for embedded power devices, from RDL and OPM through backside processing and dicing.
  • Provide technical responses and reports based on process development results.
  • Support manufacturing line startup, mass-production transition, and production-capacity expansion.
  • Improve product quality and yield while supporting new materials, manufacturing methods, and process cost reduction.
  • Address process issues in cooperation with OSAT partners.

Requirements

  • More than 2 years of experience in the relevant process area or semiconductor mass production, depending on the selected track.
  • Experience developing or evaluating process-related materials and equipment for WET, metal deposition, or lithography roles.
  • Experience in semiconductor integration development after metallization for the integration role.
  • Basic knowledge of power devices and reliability testing evaluation.
  • Practical experience in process improvement and quality control.
  • Engineering degree in mechanical engineering, materials science, electronics, chemistry, or a related field.

Nice to have

  • Semiconductor package development or wafer process technology startup experience.
  • Experience working with ISO or IATF quality standards.

Culture & Benefits

  • Flexible hybrid work model with two remote-work days per week.
  • Inclusive workplace focused on employee wellbeing and employee resource groups.
  • Opportunities to deepen hardware and software expertise and build a broader technical career.
  • Work on semiconductor products and solutions serving customers worldwide.
  • Global support environment within an organization operating across more than 30 countries.

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