Dir, Package Design Engineering

Location: Taichung, Taiwan; onsite with no remote work available

Company

hirify.global is an embedded semiconductor solution provider serving the automotive, industrial, infrastructure, and IoT markets.

What you will do

• Lead global packaging sustaining engineering across internal assembly sites and OSAT partners throughout Asia.
• Own manufacturing excellence, customer satisfaction, yield, quality, reliability, cost competitiveness, and supplier governance for released production packages.
• Lead the Japan and Malaysia Assembly Engineering groups and coordinate geographically distributed engineering teams.
• Transition qualified products from package development into mass production and address capacity and material supply issues with Supply Chain Management.
• Manage customer RMA investigations, failure analysis, root-cause analysis, CAPA, and customer communications.
• Drive yield improvement, cost and cycle-time reduction, PCN planning, MRB activities, supplier audits, scorecards, and technology alignment.

Requirements

• 15+ years of assembly engineering experience.
• MS or PhD in Materials Science or Mechanical Engineering.
• Solid OSAT management experience and extensive high-volume manufacturing experience across multiple semiconductor package platforms.
• Automotive packaging experience and assembly experience with FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, module, and 2.5D packages.
• Experience with MSAP, ETS, tenting, and ABF package substrates, plus SMT processes, warpage, and board-level reliability testing.
• Familiarity with JEDEC, IPC, automotive qualification standards, SPC, 8D, RCA, and SYL/SBL.

Culture & Benefits

• Global environment with more than 21,000 engineers and problem solvers across over 30 countries.
• Culture grounded in transparency, agility, global collaboration, innovation, and entrepreneurship.
• Competitive benefits package provided alongside salary.
• Equal opportunity workplace supporting diversity and inclusion.