Staff Package Design Engineer (Semiconductors)

Location: Kaohsiung, Taiwan; onsite at Nanzih Technology Industrial Park

Company

hirify.global manufactures discrete semiconductors and passive electronic components for automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical applications.

What you will do

• Plan and supervise development projects for new semiconductor packages, processes, equipment, and materials.
• Assess and maintain FR2/FR3 final-test checklists for package R&D projects.
• Review conversion-kit designs and fitting analyses for final-test handlers.
• Conduct kit and machine buyoffs to ensure final-test process quality.
• Develop test programs and methods with product and foundry managers, coordinate final tests, and summarize results.
• Prepare engineering documentation and support new product releases, technology transfer, and intellectual-property protection.

Requirements

• At least 5 years of experience in semiconductor packaging development.
• Familiarity with semiconductor packaging materials, processes, and equipment.
• Ability to read and write English is required.
• Good typing skills.

Culture & Benefits

• Stable global semiconductor manufacturing business with opportunities to work globally and locally.
• Open and collaborative work culture.
• Healthcare coverage and group insurance.
• Annual outing subsidy.
• On-the-job and formal training, professional development programs, and mentorship.