Staff Package Development Engineer (Semiconductor Packaging)

Location: Austin, Texas, United States; onsite role with no remote work available

Competitive benefits package alongside salary; exact compensation is not specified.

Company

hirify.global is an embedded semiconductor solution provider developing technology for automotive, industrial, infrastructure, and IoT applications.

What you will do

• Develop, qualify, and industrialize semiconductor package solutions from concept through high-volume manufacturing.
• Drive package performance, reliability, manufacturability, cost, and schedule requirements.
• Develop and qualify packages with OSAT partners and cross-functional teams spanning silicon design, package design, manufacturing, reliability, and quality.
• Apply semiconductor assembly processes including wafer backgrind, wafer dicing, die attach, flip-chip assembly, wire bonding, underfill, molding, ball attach, singulation, and SMT.
• Conduct design of experiments, statistical analysis, reliability testing, failure analysis, and root-cause investigations.
• Lead technical problem-solving, project execution, supplier coordination, and technical communication in a global development environment.

Requirements

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
• At least 5 years of experience in semiconductor package development, package integration, or advanced packaging technologies.
• Experience developing and qualifying semiconductor packages with OSAT partners.
• Knowledge of design of experiments, statistical analysis, structured problem-solving, package reliability testing, failure analysis, and root-cause investigation.
• Strong analytical, project management, communication, and cross-functional collaboration skills.
• Ability to work onsite in Austin, Texas; remote work is not available.

Nice to have

• Master’s degree or Ph.D. in a relevant engineering, materials science, physics, or chemistry discipline.
• Experience with FCCSP, SiP, fan-out packaging, wafer-level packaging, or 2.5D/3D packaging.
• Knowledge of thermal, mechanical, and electrical package characterization techniques.
• Experience with automotive-grade product qualification and reliability standards.
• Knowledge of sustainability initiatives, packaging materials selection, and cost optimization.

Culture & Benefits

• Work within a global organization of more than 21,000 engineers and problem solvers across over 30 countries.
• Collaborative culture grounded in transparency, agility, global cooperation, innovation, and entrepreneurship.
• Competitive benefits package alongside salary.
• Focus on semiconductor technologies supporting safer, healthier, greener, and smarter applications.