Module Development Engineer (Semiconductor Packaging)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $99,030–$139,810 USD

Company

hirify.global develops and manufactures semiconductor technologies and integrated circuit products.

What you will do

• Design, analyze, and develop thermal, mechanical, and electrical packaging collaterals.
• Define package performance specifications and execute technology certification through qualification plans and data collection.
• Conduct testing and research on basic materials and their properties.
• Establish material specifications for contract assemblers and raw-material vendors.
• Support packaging process improvements and resolve packaging-related problems.
• Coordinate with quality assurance, purchasing, suppliers, project stakeholders, and customers.

Requirements

• Bachelor’s degree in mechanical engineering or a related STEM field.
• At least 6 months of relevant experience through industry work, internships, coursework, or research.
• Experience with mechanical design, CAD, SolidWorks, DriveWorks, RSS analysis, geometric dimensioning, or finite element analysis.
• Ability to work on-site in Hillsboro, Oregon, United States.
• Engineering judgment and technical problem-solving skills.

Nice to have

• 3+ years of experience with material handling systems, motion control, vision systems, or high-speed pick-and-place equipment.
• Experience developing novel solutions for high-volume manufacturing processes.
• Stakeholder, supplier, or project management experience.
• Knowledge of semiconductor devices, packaging processes, statistical design of experiments, and structured problem-solving techniques.

Culture & Benefits

• Full-time employment with an on-site work model.
• Competitive pay and stock bonuses.
• Health, retirement, and vacation benefits.
• Commitment to responsible business practices and ethical hiring.