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6 часов назад

Staff Engineer, Packaging Mechanical Simulation (Semiconductor Packaging)

163 000 - 253 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Staff Engineer, Packaging Mechanical Simulation (Semiconductor Packaging): Developing and evaluating next-generation semiconductor packages and memory devices through advanced mechanical modeling with an accent on mechanical and thermal simulation, reliability, and validation. Focus on automating simulation workflows, correlating numerical models with experimental data, and solving static and dynamic linear and nonlinear analysis challenges.

Location: Daily onsite presence at the San Jose headquarters in California, United States; approximately 10% travel per month.

Base pay: $163,000–$253,000 USD per year, plus potential performance-based incentives.

Company

hirify.global develops technology solutions for smartphones, electric vehicles, hyperscale data centers, IoT devices, and other applications.

What you will do

  • Model and simulate semiconductor packages and memory devices to improve performance and reliability.
  • Provide mechanical design support from concept development and detailed modeling through qualification and reliability testing.
  • Perform mechanical and thermal modeling of microelectronic components, interconnects, solder joints, BGAs, and advanced packaging architectures.
  • Develop Python, MATLAB, or ANSYS APDL scripts to automate preprocessing, simulation, post-processing, parametric studies, and sensitivity analyses.
  • Design and interpret validation experiments to correlate and calibrate simulation models with empirical data.
  • Collaborate independently and within cross-functional, multicultural, and globally distributed teams.

Requirements

  • PhD in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or a closely related field.
  • 3–5+ years of hands-on modeling and simulation experience in the high-tech or semiconductor industry.
  • Expertise with ANSYS, Abaqus, HyperMesh, and related pre- and post-processing tools.
  • Experience with static and dynamic simulations, including linear and nonlinear analyses involving geometric and material nonlinearity.
  • Strong understanding of advanced semiconductor packaging, interconnect structures, material properties, and reliability modeling.
  • Strong technical writing and communication skills for both technical and non-technical audiences.

Culture & Benefits

  • Inclusive workplace with a diverse, multicultural workforce and emphasis on collaboration, humility, curiosity, and innovation.
  • Medical, dental, vision, and 401(k) benefits.
  • At least four weeks of paid time off annually, plus holidays and sick leave.
  • Family support benefits, including fertility and adoption assistance, medical travel support, and virtual veterinary care.
  • Emotional wellness support through on-demand applications and confidential therapy sessions.
  • Onsite café and gym, virtual fitness classes, charitable giving match, and a flexible work environment.

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