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2 дня назад

Module Development Engineer (Semiconductor Packaging)

99 030 - 162 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

Текст:
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TL;DR
Module Development Engineer (Semiconductor Packaging): Designing, analyzing, qualifying, and sustaining thermal, mechanical, and electrical packaging media for semiconductor assemblies with an accent on material specifications, package performance, and high-volume manufacturing. Focus on developing novel packaging solutions, conducting qualification testing, and solving complex mechanical and material problems across suppliers, quality, purchasing, and internal engineering teams.

Location: On-site in Hillsboro, Oregon, United States

Salary: $99,030–$162,500 USD annually

Company

hirify.global develops semiconductor technologies, integrated circuits, electronic components, and related manufacturing solutions.

What you will do

  • Design, analyze, and develop thermal, mechanical, and electrical packaging media.
  • Define package performance specifications and lead technology certification through qualification plans and data collection.
  • Conduct tests and research on materials, properties, and packaging performance.
  • Establish material specifications for contract assemblers and raw-material vendors.
  • Collaborate with Quality Assurance, Purchasing, suppliers, internal partners, and customers on material quality and packaging improvements.
  • Manage full-cycle projects and develop solutions using engineering judgment and formal problem-solving methods.

Requirements

  • Bachelor’s degree in mechanical engineering or a related STEM field with 4+ years of experience, or a master’s degree with 2+ years of experience.
  • Experience with mechanical design, CAD, SolidWorks, DriveWorks, RSS analysis, geometric dimensioning, or finite element analysis.
  • Full-cycle project management experience.
  • Technical and analytical skills with knowledge of statistical design of experiments and problem-solving techniques.
  • Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

  • Experience with material handling systems, high-speed pick-and-place, motion control, or vision systems.
  • Semiconductor devices, packaging processes, or packaging technology experience.
  • Stakeholder management involving suppliers, projects, or internal partners.
  • Media design or equipment collateral experience.
  • Experience developing novel design solutions for high-volume manufacturing.

Culture & Benefits

  • Full-time experienced-hire position on Shift 1.
  • Competitive pay with potential stock bonuses.
  • Health, retirement, and vacation benefits.
  • Commitment to ethical hiring and responsible business practices.
  • No recruitment, medical examination, or other employment-related fees are charged to candidates.

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