2 дня назад
Module Development Engineer (Semiconductor Packaging)
99 030 - 162 500$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Module Development Engineer (Semiconductor Packaging): Designing, analyzing, qualifying, and sustaining thermal, mechanical, and electrical packaging media for semiconductor assemblies with an accent on material specifications, package performance, and high-volume manufacturing. Focus on developing novel packaging solutions, conducting qualification testing, and solving complex mechanical and material problems across suppliers, quality, purchasing, and internal engineering teams.
Location: On-site in Hillsboro, Oregon, United States
Salary: $99,030–$162,500 USD annually
Company
develops semiconductor technologies, integrated circuits, electronic components, and related manufacturing solutions.
What you will do
- Design, analyze, and develop thermal, mechanical, and electrical packaging media.
- Define package performance specifications and lead technology certification through qualification plans and data collection.
- Conduct tests and research on materials, properties, and packaging performance.
- Establish material specifications for contract assemblers and raw-material vendors.
- Collaborate with Quality Assurance, Purchasing, suppliers, internal partners, and customers on material quality and packaging improvements.
- Manage full-cycle projects and develop solutions using engineering judgment and formal problem-solving methods.
Requirements
- Bachelor’s degree in mechanical engineering or a related STEM field with 4+ years of experience, or a master’s degree with 2+ years of experience.
- Experience with mechanical design, CAD, SolidWorks, DriveWorks, RSS analysis, geometric dimensioning, or finite element analysis.
- Full-cycle project management experience.
- Technical and analytical skills with knowledge of statistical design of experiments and problem-solving techniques.
- Ability to work on-site in Hillsboro, Oregon, United States.
Nice to have
- Experience with material handling systems, high-speed pick-and-place, motion control, or vision systems.
- Semiconductor devices, packaging processes, or packaging technology experience.
- Stakeholder management involving suppliers, projects, or internal partners.
- Media design or equipment collateral experience.
- Experience developing novel design solutions for high-volume manufacturing.
Culture & Benefits
- Full-time experienced-hire position on Shift 1.
- Competitive pay with potential stock bonuses.
- Health, retirement, and vacation benefits.
- Commitment to ethical hiring and responsible business practices.
- No recruitment, medical examination, or other employment-related fees are charged to candidates.
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