Packaging Module Equipment Development Engineer

TL;DR

Packaging Module Equipment Development Engineer (Semiconductor): Developing and optimizing advanced semiconductor packaging technologies and assembly processes for high-volume manufacturing with an accent on thermal mechanical coupling and interconnect reliability. Focus on innovating next-generation equipment and fabrication processes to support future computing platforms.

Location: Must be based in Phoenix, Arizona (Onsite)

Salary: $133,800–$188,890 USD

Company

A global leader in semiconductor technology, driving innovation in computing and manufacturing.

What you will do

• Develop and scale First Level/Second Level Interconnect and thermal solutions for packaging platforms.
• Collaborate with cross-functional teams to optimize assembly processes for yield, reliability, and cost.
• Innovate next-generation equipment and fabrication processes for high-volume manufacturing.
• Manage technical projects to meet development timelines and performance goals.
• Provide sustaining support for equipment performance and process health.
• Respond to foundry customer requests and technical events.

Requirements

• PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related STEM field.
• Minimum GPA of 3.5.
• At least one publication in a peer-reviewed technical journal.
• Deep understanding of solid mechanics and thermal mechanical coupling behaviors.
• Must be able to work onsite in Phoenix, Arizona.
• 6+ months of relevant experience (including internships or research).

Nice to have

• Experience with Statistical Process Control (SPC) and Design of Experiments (DOE).
• Background in semiconductor fabrication processes.
• Experience delivering results for complex, time-critical technical projects.

Culture & Benefits

• Competitive compensation package including stock bonuses.
• Comprehensive health and retirement benefit programs.
• Opportunities for professional growth within a leading technology corporation.
• Collaborative environment focused on innovation and technical leadership.