Package Design Engineering Director (Semiconductor)

Location: Shah Alam, Selangor, Malaysia. Onsite role; remote work is not available.

Company

hirify.global is a global embedded semiconductor solution provider serving automotive, industrial, infrastructure, and IoT markets, with more than 21,000 engineers and problem solvers across over 30 countries.

What you will do

• Lead sustaining engineering and high-volume manufacturing performance across semiconductor package assembly technologies and product lines.
• Own yield monitoring, trend analysis, corrective actions, process control, defect reduction, and continuous improvement initiatives.
• Partner with Quality and Reliability teams to maintain qualification requirements, resolve manufacturing and field quality issues, and support audits.
• Lead process changes, qualification plans, manufacturing readiness, and NPI-to-HVM product transfers.
• Manage global OSAT and contract manufacturing relationships, including technical reviews, audits, benchmarking, qualification, and cost improvement.
• Build and develop a high-performing global assembly engineering organization through talent development and succession planning.

Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical discipline.
• At least 12 years of semiconductor manufacturing and packaging engineering experience, including IC assembly, package development, qualification, and NPI-to-HVM transfers.
• At least 5 years of leadership experience managing engineering teams in semiconductor manufacturing environments.
• Strong expertise in wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies.
• Deep knowledge of yield analysis, SPC, DOE, reliability, process control, qualification methods, and statistical analysis tools.
• Experience managing global OSAT partners and outsourced manufacturing ecosystems, with strong analytical, communication, organizational, and cross-functional leadership skills.

Nice to have

• Master’s degree or PhD in Engineering or a related field.
• Experience with 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, advanced interconnects, DBC, and AMB substrates.
• Experience with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, or wide-bandgap manufacturing.
• Knowledge of JEDEC, IPC, and customer qualification requirements.

Culture & Benefits

• Culture grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial.
• Collaborative work across global engineering, manufacturing, supply chain, quality, R&D, and external OSAT teams.
• Competitive benefits package alongside salary.
• Equal opportunity and affirmative action workplace supporting diversity and inclusion.