1 день назад
Senior Staff Packaging Engineering (AI)
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior Staff Packaging Engineering (AI): Driving the design, qualification, manufacturing transition, and optimization of semiconductor packaging systems with an accent on packaging reliability, assembly processes, yield improvement, and cost reduction. Focus on leading high-volume manufacturing introductions, developing packaging technology roadmaps, and applying machine learning and data analytics to packaging engineering.
Location: Batu Kawan, Penang, Malaysia; onsite at the Penang SDSM Office
Company
develops Flash memory and advanced memory technology solutions supported by global manufacturing capabilities and supply chains.
What you will do
- Set technical direction for package characterization, qualification, production release, reliability, quality, and performance.
- Own the package lifecycle across design, development, qualification, manufacturing, and high-volume production.
- Lead collaboration with global factories, contract manufacturers, Packaging R&D, and cross-functional engineering teams.
- Develop and qualify next-generation packaging technologies and advanced assembly processes.
- Drive assembly yield improvement, package cost reduction, manufacturing scalability, and technology roadmap execution.
- Lead DFX analyses, including DFM, DFA, and DFRW, while establishing FMEA, SOD, control plans, process recipes, and SPC readiness.
Requirements
- Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics, or another engineering discipline.
- At least 10 years of relevant experience with a Master’s degree, or 8+ years with a PhD.
- Strong knowledge of SMT, PCBA, solder-joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.
- Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives.
- Strong problem-solving, experimental design, statistical analysis, and communication skills.
- Experience with machine learning and data analytics using AI technologies.
Nice to have
- Experience with flash back-end processes for active-component manufacturing.
- Experience mentoring or managing junior engineers.
- Familiarity with industry benchmarking trends and packaging technology roadmap development.
Culture & Benefits
- Full-time exempt employment.
- Work with global cross-functional teams and worldwide packaging and assembly organizations.
- Inclusive environment focused on diversity, belonging, respect, and contribution.
- Accessibility support is available throughout the application and hiring process.
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