Назад
Company hidden
2 дня назад

Silicon Packaging Design Engineer (Semiconductor)

Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/

TL;DR

Silicon Packaging Design Engineer (Semiconductor): Driving end-to-end substrate design and optimization for high-performance semiconductor products with an accent on physical layout, routing, and manufacturability. Focus on optimizing silicon-package-board interfaces and resolving design rule checks to ensure product quality and cost-efficiency.

Location: Hybrid (Penang or Kulim, Malaysia)

Company

hirify.global is a global leader in semiconductor manufacturing through its Foundry business, focusing on advanced packaging and silicon process technology.

What you will do

  • Lead the full substrate design cycle from initial design through tapeout.
  • Implement physical layout and routing using tools like Cadence APD or Mentor Xpedition.
  • Conduct routing studies to balance performance, cost, and manufacturability tradeoffs.
  • Define and document detailed package design requirements in official documentation.
  • Collaborate with silicon and hardware teams to optimize pinouts and board interfaces.
  • Perform design reviews and resolve DRCs to ensure high-quality outputs.

Requirements

  • Bachelor's degree in Electrical, Mechanical, or Electronics Engineering (or related).
  • At least 4 years of experience in substrate/package design (3 for Master's, 0 for PhD).
  • Proficiency in Cadence APD or Mentor Xpedition layout and routing tools.
  • Experience using Electrical Design Analysis software.
  • Strong knowledge of substrate design rules and DRC resolution.
  • Must be based in or able to work in a hybrid model in Penang or Kulim, Malaysia.

Nice to have

  • Familiarity with high-speed signal integrity and power delivery.
  • Strong analytical and problem-solving skills.
  • Experience working in cross-functional teams and providing feedback to stakeholders.

Culture & Benefits

  • Hybrid work model allowing a split between on-site and off-site work.
  • Opportunity to work with industry-leading semiconductor technology.
  • Collaborative environment within a worldwide factory network.
  • Commitment to ethical hiring and RBA compliance.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →