Silicon Packaging Design Engineer (Semiconductor)

Location: Hybrid (Penang or Kulim, Malaysia)

Company

hirify.global is a global leader in semiconductor manufacturing through its Foundry business, focusing on advanced packaging and silicon process technology.

What you will do

• Lead the full substrate design cycle from initial design through tapeout.
• Implement physical layout and routing using tools like Cadence APD or Mentor Xpedition.
• Conduct routing studies to balance performance, cost, and manufacturability tradeoffs.
• Define and document detailed package design requirements in official documentation.
• Collaborate with silicon and hardware teams to optimize pinouts and board interfaces.
• Perform design reviews and resolve DRCs to ensure high-quality outputs.

Requirements

• Bachelor's degree in Electrical, Mechanical, or Electronics Engineering (or related).
• At least 4 years of experience in substrate/package design (3 for Master's, 0 for PhD).
• Proficiency in Cadence APD or Mentor Xpedition layout and routing tools.
• Experience using Electrical Design Analysis software.
• Strong knowledge of substrate design rules and DRC resolution.
• Must be based in or able to work in a hybrid model in Penang or Kulim, Malaysia.

Nice to have

• Familiarity with high-speed signal integrity and power delivery.
• Strong analytical and problem-solving skills.
• Experience working in cross-functional teams and providing feedback to stakeholders.

Culture & Benefits

• Hybrid work model allowing a split between on-site and off-site work.
• Opportunity to work with industry-leading semiconductor technology.
• Collaborative environment within a worldwide factory network.
• Commitment to ethical hiring and RBA compliance.