CUF TD Module Engineer (Semiconductor Packaging)

Location: Onsite in Kulim, Malaysia; regular onsite presence is required.

Company

hirify.global develops semiconductor technologies and advanced assembly packaging platforms.

What you will do

• Develop assembly processes and equipment for CUF (capillary underfill) modules and future packaging platforms.
• Optimize package manufacturing for quality, reliability, cost, yield, productivity, and manufacturability.
• Define process and equipment specifications using design of experiments and statistical data analysis.
• Develop and maintain equipment for evaluating silicon and package technologies under simulated field-use conditions.
• Establish material specifications and collaborate with contract assemblers, vendors, supplier quality, and procurement teams.
• Lead packaging problem-solving, reliability improvements, qualification standardization, and process maturity activities.

Requirements

• At least 3 years of relevant work experience.
• MSc or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Chemical Engineering, Physics, or a related engineering discipline; a Bachelor's degree with strong relevant experience may also be considered.
• Focus or experience in thermal, fluid, packaging assembly process engineering, or a related area.
• Fundamental understanding of semiconductor assembly equipment and processes.
• Ability to work onsite in Kulim, Malaysia with regular onsite presence.

Nice to have

• Experience developing new processes through hardware or toolset development.

Culture & Benefits

• Full-time experienced-hire position on Shift 1 in Malaysia.
• Work involves collaboration with packaging technology development and partner engineering groups.
• Ethical hiring practices with no recruitment, medical examination, or other hiring-related fees.