Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)

Location: Singapore, Singapore

Company

hirify.global develops materials science and engineering solutions for semiconductor chips and advanced displays.

What you will do

• Develop and integrate advanced packaging building blocks, including redistribution layers, damascene copper structures, wafer-level interconnects, and hybrid bonding processes.
• Support the Process Integration team in developing and characterizing test vehicles for chip-to-wafer and wafer-to-wafer hybrid bonding.
• Develop process flows and design experiments for advanced packaging applications.
• Analyze experimental data and characterize defects.
• Correlate process parameters with electrical and physical performance metrics.
• Contribute to R&D projects for next-generation semiconductor packaging solutions.

Requirements

• Interest in semiconductor fabrication, advanced packaging integration, and engineering problem-solving.
• Ability to support process development, experimental design, data analysis, and defect characterization activities.
• Availability for a full-time internship in Singapore.
• Relocation is not available for this position.

Culture & Benefits

• Supportive environment focused on learning, development, and career growth.
• Opportunities to gain hands-on exposure to semiconductor fabrication and advanced packaging technologies.
• Employee health and wellbeing programs and support for personal and professional growth.
• No business travel is required.