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1 день назад

Principal Engineer Process Engineering (Advanced Packaging)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Singapore
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal Engineer Process Engineering (Advanced Packaging): Developing and optimizing advanced packaging unit processes for bond and debond, plasma/UV cleaning, die re-constitution, annealing, and TSV on multi-stack bond wafer and die-to-wafer processes with an accent on process performance, yield, reliability, stability, and cost of ownership. Focus on designing experiments, qualifying new equipment, resolving complex process and yield issues, and improving process capability for high-volume manufacturing.

Location: Singapore; full-time onsite role

Company

hirify.global is a semiconductor manufacturer delivering power-efficient and high-performance solutions for high-growth markets through manufacturing operations across the United States, Europe, and Asia.

What you will do

  • Develop and optimize advanced packaging unit processes, including bond and debond, pre-bond plasma/UV/cleaning, die re-constitution, annealing, and TSV.
  • Design, execute, and analyze experiments to meet performance, yield, reliability, process stability, and cost targets.
  • Start up and qualify new processes and equipment, support equipment acceptance and tool matching, and install processes into manufacturing.
  • Improve process robustness and capability for high-volume manufacturing using statistical tools, DOE, SPC, lean manufacturing, and Six Sigma.
  • Troubleshoot complex process, equipment, and yield issues while improving productivity, quality, cost, and reliability.
  • Support integration and quality teams, lead continuous improvement programs, and coach engineers on advanced packaging etch processes.

Requirements

  • BS, Master’s, or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics, or a relevant engineering or physical science discipline.
  • Relevant experience with bonder processes and tools, including TEL W2W and BESI D2W.
  • Experience with die re-constitution and annealing process tools such as TEL Alpha 303 and Mattson Helios.
  • Manufacturing and development experience in related processes.
  • Excellent verbal and written communication skills.
  • Strong interpersonal skills and the ability to work effectively across different cultures.

Culture & Benefits

  • Work in a multicultural and inclusive environment focused on security, longevity, and sustainability.
  • Support environmental, health, safety, and security requirements and programs.
  • Employment offers are subject to applicable background checks, medical screenings, and local laws.
  • No recruitment fees are charged at any stage of the hiring process.

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