Manufacturing Engineer - Molding and Back End (Electronics Packaging)

Location: Andover, Massachusetts, United States

Salary: $95,000–$115,000 per year

Company

hirify.global develops advanced power component solutions and electronic packaging processes for commercial, automotive, hyperscaler, military, and industrial applications.

What you will do

• Develop, characterize, qualify, and transition electronics packaging processes and equipment into production.
• Improve existing manufacturing methods and develop cost-effective solutions for new products using transfer molding and precision automated grinding.
• Program and support production equipment, including occasional maintenance and troubleshooting.
• Implement real-time statistical process control and Six Sigma tools, including PFMEAs, to improve yield, throughput, quality, and cost.
• Monitor line performance, investigate root causes, and implement corrective and preventive actions.
• Lead cross-functional development, cost reduction, and quality improvement initiatives with Design, Test, Quality Engineering, production, and maintenance teams.

Requirements

• Bachelor’s degree in Mechanical, Chemical, Plastics, or Manufacturing Engineering.
• 3–5 years of experience in electronics packaging and/or manufacturing.
• Knowledge of transfer or injection molding manufacturing and materials engineering.
• Hands-on engineering skills with production equipment, plus strong problem-solving, statistical, writing, and organizational abilities.
• Experience with design software such as SolidWorks, Pro/Engineer, or AutoCAD.
• Ability to work independently, analyze moderately complex technical problems, and operate effectively in a fast-paced environment.

Nice to have

• Master’s degree in a relevant engineering discipline.
• Experience with IATF 16949, PPAP, BIQ, or FTQ automotive requirements.
• Moldflow experience.

Culture & Benefits

• Fast-paced, team-oriented engineering environment.
• Hands-on collaboration with production and maintenance personnel.
• Opportunity to support next-generation power component manufacturing for diverse applications.