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11 дней назад

Sr Staff Process Engineer (Semiconductor)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Thailand
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr Staff Process Engineer (Semiconductor): Qualifying and improving thin-die assembly processes for Power QFN packages and Cu Clip-related SPS products with an accent on manufacturing yield, capacity, quality, and cost. Focus on designing package processes, transferring NPI products to production, sustaining manufacturing lines, and managing OSAT and supplier relationships.

Location: Bangkok, Thailand; onsite only

Company

hirify.global is an embedded semiconductor solutions provider developing technology for automotive, industrial, infrastructure, and IoT applications.

What you will do

  • Design packages and develop qualification processes for Power QFN packages used in SPS products and associated modules.
  • Ramp up manufacturing volume and qualify required production sources.
  • Sustain assembly lines by improving yield, capacity, quality, and cost.
  • Resolve internal and external customer issues in collaboration with Test, Product Engineering, Quality, and Operations.
  • Maintain Product Lifecycle Management documentation and manage supplier change initiatives.
  • Support NPI-to-production transfers and manage OSAT and contract manufacturing relationships.

Requirements

  • Degree in Mechanical Engineering, Materials, Physics, Chemistry, or Applied Sciences.
  • Experience in process engineering or package development involving thin-wafer handling and SPS solder attach processes.
  • Knowledge of quality and reliability requirements for PQFN/QFN, Module SMT, and leaded packages.
  • Knowledge of SPC and statistical analysis software such as JMP.
  • Strong English communication skills, including written communication and presentations.
  • Ability to manage large projects effectively and collaborate across engineering, quality, operations, and suppliers.

Nice to have

  • Experience with Cu Clip, Thin Die, Power QFN, and Taiko wafers.
  • Package development knowledge.
  • Experience transitioning products from development to production and supporting NPI through mass production.
  • Experience with ultra-thin wafer handling and SPS solder attach processes.

Culture & Benefits

  • Collaborative global environment with engineers and problem solvers across more than 30 countries.
  • Culture centered on transparency, agility, global collaboration, innovation, and entrepreneurship.
  • Competitive benefits package provided alongside the salary.
  • Equal opportunity workplace supporting diversity and a discrimination-free environment.

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