Process Engineer (IC Pre-assembly)

Location: Bangkok, Thailand

Company

hirify.global develops semiconductor solutions for applications across automotive, industrial, and connected device markets.

What you will do

• Support daily sustaining activities for high-volume manufacturing products.
• Coordinate NPI activities for pre-assembly processes, including release reviews and safe launch data analysis.
• Investigate NPI failures, production line issues, and customer feedback through root cause analysis.
• Drive yield, quality, productivity, and cost improvement projects with production, QA, and EE teams.
• Lead process change management and maintain related documentation.
• Assess and revise process controls, work instructions, FMEA, and control plans while supporting internal, certification, and customer audits.

Requirements

• Bachelor’s degree in Engineering, Physics, or a related field.
• At least 5 years of experience with IC pre-assembly processes, including blade dicing, laser grooving, stealth dicing, or wafer mounting.
• Strong knowledge of statistics and proficiency with Minitab or JMP.
• Solid understanding of process control, quality management systems, and process audits.
• Background in pre-assembly project management, risk assessment, and Advanced Product Quality Planning.
• Good written and spoken English communication skills.

Nice to have

• Lean Six Sigma certification.

Culture & Benefits

• Work on semiconductor manufacturing and new product introduction activities.
• Collaborate cross-functionally with production, quality assurance, and engineering teams.
• Contribute to structured problem solving, process robustness, and continuous improvement initiatives.