Packaging Module Development Engineer (Semiconductor Packaging)

Location: Onsite in Phoenix, Arizona, United States

Annual salary: $99,030–$162,500 USD

Company

hirify.global designs and manufactures silicon products and develops technologies for connected devices and digital experiences.

What you will do

• Develop assembly processes and equipment for future semiconductor packaging platform technologies.
• Optimize package manufacturing for quality, reliability, cost, yield, productivity, and manufacturability.
• Create process and equipment specifications using Design of Experiments and data analysis.
• Develop and maintain equipment for evaluating silicon and package technologies under simulated field-use conditions.
• Establish material specifications and coordinate with contract assemblers, suppliers, quality teams, and procurement.
• Develop reliability requirements, quality screens, qualification methods, and process improvements for packaging technologies.

Requirements

• Bachelor's degree with 4+ years of experience or Master's degree with 2+ years of experience in Engineering, Physics, Computer Science, or a related field.
• US citizenship is required.
• Ability to obtain and maintain a US Government Security Clearance.
• At least 1 year of experience in manufacturing-related inspection.
• Knowledge of semiconductor devices and packaging technology, statistical methods, process control, and Design of Experiments.
• Experience with Python, data management, visualization, computer vision, OpenCV, and machine learning classification or object detection is preferred.

Culture & Benefits

• Regular onsite presence is required.
• Shift 1 working schedule in the United States.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Work focuses on innovation, problem solving, product qualification, and collaboration with packaging technology and partner engineering groups.