Thermal Quality and Reliability Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $120,860–$170,630 USD

Company

hirify.global develops semiconductor technologies and operates foundry manufacturing, packaging, assembly, and test capabilities for computing products.

What you will do

• Develop and maintain quality and reliability standards for semiconductor packaging components.
• Define inspection, testing, metrology, and qualification strategies across packaging modules.
• Evaluate materials, production processes, and packaging technologies against product and system requirements.
• Develop equipment and simulated field-condition testing for silicon and packaging technologies.
• Analyze quality and wearout reliability data, identify risks, and recommend process improvements.
• Develop reliability models, acceleration techniques, analytical tools, and quality screens while collaborating with internal teams and external partners.

Requirements

• PhD in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or a related field.
• At least 6 months of experience with semiconductor packaging, assembly processes, and failure modes and mechanisms.
• Knowledge of statistical process control, reliability modeling, statistical data analysis, and design of experiments.
• Experience or familiarity with BGA, wafer-level manufacturing, and analytical techniques such as acoustic imaging, SEM, EDX, FTIR, or mechanical testing.
• Programming or scripting experience for data analysis using Python, SQL, or similar tools.
• Ability to lead cross-functional work and troubleshoot quality issues using methods such as 8D and 5 Whys.

Culture & Benefits

• Work within hirify.global Foundry's engineering and manufacturing community.
• On-site Shift 1 position in the United States.
• Compensation package includes competitive pay and stock bonuses.
• Benefits include health coverage, retirement programs, and vacation.