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updated 4 days ago

Thermal Quality and Reliability Engineer (Semiconductor Packaging)

120 860 - 170 630$
Work format
onsite
Work type
fulltime
Grade
junior
English
b2
Country
US

Job description

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TL;DR
Thermal Quality and Reliability Engineer (Semiconductor Packaging): Developing quality and reliability standards, inspection strategies, testing equipment, and reliability models for semiconductor packaging components with an accent on statistical analysis, failure mechanisms, and manufacturing quality. Focus on evaluating packaging materials and processes, identifying wearout risks, developing accelerated testing techniques, and troubleshooting quality excursions across cross-functional teams.

Location: On-site in Phoenix, Arizona, United States

Annual salary: $120,860–$170,630 USD

Company

hirify.global develops semiconductor technologies and operates foundry manufacturing, packaging, assembly, and test capabilities for computing products.

What you will do

  • Develop and maintain quality and reliability standards for semiconductor packaging components.
  • Define inspection, testing, metrology, and qualification strategies across packaging modules.
  • Evaluate materials, production processes, and packaging technologies against product and system requirements.
  • Develop equipment and simulated field-condition testing for silicon and packaging technologies.
  • Analyze quality and wearout reliability data, identify risks, and recommend process improvements.
  • Develop reliability models, acceleration techniques, analytical tools, and quality screens while collaborating with internal teams and external partners.

Requirements

  • PhD in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or a related field.
  • At least 6 months of experience with semiconductor packaging, assembly processes, and failure modes and mechanisms.
  • Knowledge of statistical process control, reliability modeling, statistical data analysis, and design of experiments.
  • Experience or familiarity with BGA, wafer-level manufacturing, and analytical techniques such as acoustic imaging, SEM, EDX, FTIR, or mechanical testing.
  • Programming or scripting experience for data analysis using Python, SQL, or similar tools.
  • Ability to lead cross-functional work and troubleshoot quality issues using methods such as 8D and 5 Whys.

Culture & Benefits

  • Work within hirify.global Foundry's engineering and manufacturing community.
  • On-site Shift 1 position in the United States.
  • Compensation package includes competitive pay and stock bonuses.
  • Benefits include health coverage, retirement programs, and vacation.