Packaging Module Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $85,200–$162,500 USD

Company

hirify.global develops semiconductor technologies and next-generation packaging platforms.

What you will do

• Develop and optimize substrate processes and equipment for advanced packaging technologies.
• Define equipment configurations, process specifications, and integrated process flows for new technologies.
• Plan and conduct design of experiments to characterize process windows and interactions among processes, equipment, materials, and chemistry.
• Improve process capability and stability, quality, reliability, cost, yield, automation, and productivity.
• Lead and participate in cross-functional and cross-organizational substrate technology development teams.

Requirements

• Bachelor’s or master’s degree in Biomedical Engineering, Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, or a related engineering or STEM field.
• At least 3 months of combined experience with circuit assembly, embedded programming, or engineering programming.
• Programming experience with tools such as MATLAB or Python and CAD modeling skills.
• Strong analytical, problem-solving, communication, and independent working skills.
• Ability to work on-site in Phoenix, Arizona, United States.

Nice to have

• Experience with COMSOL, Fluent, ANSYS, or similar mechanical and CFD modeling tools.
• Semiconductor or packaging processing experience.
• Programming or script development involving artificial hirify.globalligence and machine learning concepts.
• Experience combining experiments with simulations.
• Fundamental knowledge of plating chemistry and electrochemistry.

Culture & Benefits

• Full-time employment with Shift 1 scheduling.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Work in a fast-paced environment with changing product roadmaps and priorities.
• Collaborate across functions and organizations on advanced packaging technology development.