Packaging Module Development Engineer (Semiconductor Metrology)

TL;DR

Packaging Module Development Engineer (Semiconductor Metrology): Developing and sustaining metrology systems, measurement methods, and inspection equipment for advanced packaging and Thermal Compression Bonding technologies with an accent on process control, measurement capability, and yield improvement. Focus on qualifying equipment, analyzing measurement variation, correlating tools across laboratory and manufacturing environments, and improving repeatability, reproducibility, and data integrity.

Location: On-site in Phoenix, Arizona, United States. The role requires regular on-site presence and is aligned with the United States shift.

Annual salary: $133,800–$188,890 USD.

Company

hirify.global develops semiconductor technologies and advanced packaging solutions for computing and manufacturing applications.

What you will do

• Develop, qualify, and sustain metrology systems, measurement processes, inspection equipment, calibration methods, and correlation techniques.
• Improve measurement repeatability, reproducibility, consistency, process control, product quality, reliability, productivity, and yield.
• Apply design of experiments, statistical analysis, and measurement system analysis across tools, sites, and product generations.
• Define measurement specifications and ensure traceability, data integrity, and equipment capability with suppliers and internal engineering organizations.
• Provide technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements.
• Support standardization of metrology methods and readiness assessments for packaging technology and product milestones.

Requirements

• Bachelor's degree with 4+ years, Master's degree with 3+ years, or PhD with 1+ years of relevant engineering or metrology experience.
• At least 1 year of hands-on experience developing metrology systems, qualifying measurement equipment, performing calibration, or developing measurement methods.
• At least 2 years of experience with measurement system analysis, including bias, linearity, stability, repeatability, and reproducibility.
• At least 2 years of experience with electrical measurements and testing, plus optical metrology involving microscopes, imaging systems, inspection methods, or machine vision.
• At least 2 years of experience using data analysis tools such as Python, Excel, SQL, or similar tools.
• On-site work in Phoenix, Arizona, United States is required.

Nice to have

• Semiconductor manufacturing or advanced packaging experience.
• Experience with equipment selection, tool qualification, acceptance testing, calibration traceability, and automated inspection.
• Experience with lab-to-factory correlation, tool matching, cross-tool agreement studies, DOE, and metrology method optimization.
• Knowledge of quality systems, measurement documentation, and metrology standardization.
• Experience working with suppliers, vendors, or external calibration and measurement service providers.

Culture & Benefits

• Full-time employment with health, retirement, and vacation benefits.
• Competitive pay and stock bonus opportunities.
• On-site work model in a semiconductor manufacturing environment.
• Commitment to ethical hiring and responsible business practices; no recruitment or employment fees are charged.