2 дня назад
Senior PCB Design Layout Engineer
150 000 - 170 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior PCB Design Layout Engineer (Cadence Allegro/OrCAD, High-Speed Memory Hardware): Developing complex multilayer PCB layouts for high-performance memory and advanced hardware products with an accent on high-speed digital, mixed-signal, power, HDI, and controlled-impedance design. Focus on routing DDR, PCIe, and CXL interfaces, optimizing signal and power integrity, and delivering manufacturable designs from floor planning through fabrication release.
Location: Remote within the Pacific Time Zone, with preference for California. Hybrid and onsite options are available at Newark, California, and Irvine, California.
Base pay in California: $150,000–$170,000 per year, plus bonus eligibility.
Company
develops and delivers high-performance AI, memory, computing, and enterprise infrastructure solutions.
What you will do
- Own PCB layout execution from floor planning through fabrication and assembly release.
- Design complex multilayer, high-speed digital, mixed-signal, power, and HDI boards.
- Implement component placement, differential-pair routing, controlled-impedance lines, BGA escape routing, and length matching.
- Define constraints for DDR, PCIe, CXL, and other high-speed interfaces using Cadence Allegro Constraint Manager.
- Collaborate with hardware, SI/PI, mechanical, manufacturing, test, fabrication, assembly, and customer-facing teams.
- Lead design and DFM reviews, prepare release documentation, and mentor junior PCB designers.
Requirements
- 8+ years of PCB design and layout experience for high-speed digital, mixed-signal, and power designs.
- 5+ years of hands-on experience with Cadence Allegro and OrCAD Capture.
- Strong knowledge of controlled-impedance routing, differential pairs, length matching, timing/skew management, return paths, and crosstalk.
- Experience with complex multilayer PCBs, preferably 12–24+ layers, including HDI, blind and buried vias, microvias, via-in-pad, sequential lamination, and fine-pitch BGAs.
- Experience with power supply, analog, mixed-signal, and power delivery layouts, including JEDEC DDR4 and DDR5 standards.
- Bachelor’s degree in Electrical Engineering, Electronics, or a related discipline preferred; equivalent experience considered.
Nice to have
- Experience with DDR3, MRDIMM, CXL, PCIe, memory modules, server boards, accelerator cards, storage products, or high-speed embedded systems.
- Experience with invention disclosure or patent processes.
Culture & Benefits
- Collaborative environment focused on ownership, innovation, and servant leadership.
- Medical, dental, and vision benefits.
- 401(k) savings plan, paid time off, life insurance, and employee assistance plan.
- No anticipated travel.
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