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2 дня назад

Senior PCB Design Layout Engineer

150 000 - 170 000$
Формат работы
remote (только USA)/hybrid/onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior PCB Design Layout Engineer (Cadence Allegro/OrCAD, High-Speed Memory Hardware): Developing complex multilayer PCB layouts for high-performance memory and advanced hardware products with an accent on high-speed digital, mixed-signal, power, HDI, and controlled-impedance design. Focus on routing DDR, PCIe, and CXL interfaces, optimizing signal and power integrity, and delivering manufacturable designs from floor planning through fabrication release.

Location: Remote within the Pacific Time Zone, with preference for California. Hybrid and onsite options are available at Newark, California, and Irvine, California.

Base pay in California: $150,000–$170,000 per year, plus bonus eligibility.

Company

hirify.global develops and delivers high-performance AI, memory, computing, and enterprise infrastructure solutions.

What you will do

  • Own PCB layout execution from floor planning through fabrication and assembly release.
  • Design complex multilayer, high-speed digital, mixed-signal, power, and HDI boards.
  • Implement component placement, differential-pair routing, controlled-impedance lines, BGA escape routing, and length matching.
  • Define constraints for DDR, PCIe, CXL, and other high-speed interfaces using Cadence Allegro Constraint Manager.
  • Collaborate with hardware, SI/PI, mechanical, manufacturing, test, fabrication, assembly, and customer-facing teams.
  • Lead design and DFM reviews, prepare release documentation, and mentor junior PCB designers.

Requirements

  • 8+ years of PCB design and layout experience for high-speed digital, mixed-signal, and power designs.
  • 5+ years of hands-on experience with Cadence Allegro and OrCAD Capture.
  • Strong knowledge of controlled-impedance routing, differential pairs, length matching, timing/skew management, return paths, and crosstalk.
  • Experience with complex multilayer PCBs, preferably 12–24+ layers, including HDI, blind and buried vias, microvias, via-in-pad, sequential lamination, and fine-pitch BGAs.
  • Experience with power supply, analog, mixed-signal, and power delivery layouts, including JEDEC DDR4 and DDR5 standards.
  • Bachelor’s degree in Electrical Engineering, Electronics, or a related discipline preferred; equivalent experience considered.

Nice to have

  • Experience with DDR3, MRDIMM, CXL, PCIe, memory modules, server boards, accelerator cards, storage products, or high-speed embedded systems.
  • Experience with invention disclosure or patent processes.

Culture & Benefits

  • Collaborative environment focused on ownership, innovation, and servant leadership.
  • Medical, dental, and vision benefits.
  • 401(k) savings plan, paid time off, life insurance, and employee assistance plan.
  • No anticipated travel.

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