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11 часов назад

Principal Hardware Engineer - High Speed PCB (RUCKUS)

135 600 - 200 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal Hardware Engineer - High Speed PCB (RUCKUS) (Wi-Fi hardware): Designing and validating system- and board-level RF subcircuits and high-speed digital hardware for Wi-Fi access points and accessories with an accent on PCB design, signal integrity, power integrity, and wireless interfaces. Focus on bringing up complex designs, integrating RF and antenna systems, supporting compliance testing, and sustaining legacy products.

Location: Hybrid in Carson, California, United States; the role also references the RUCKUS hardware engineering team in Sunnyvale, California.

Salary: $135,600–$200,000 base compensation per year, plus benefits and additional incentives.

Company

hirify.global develops connectivity solutions, including RUCKUS wireless infrastructure, Wi-Fi, LTE, and switching products.

What you will do

  • Design and bring up Wi-Fi access point products and accessories.
  • Debug and validate Wi-Fi access point hardware designs.
  • Investigate, present, and evaluate new hardware solutions and proofs of concept.
  • Review outsourced designs and coordinate with electrical, mechanical, software, RF, and antenna engineering teams.
  • Create product documentation, including PRDs, HRDs, HWFS, BOMs, test plans, and failure analysis reports.
  • Support compliance testing and sustain legacy products.

Requirements

  • BSEE degree and 5+ years of relevant high-speed digital hardware design experience.
  • Experience with schematic capture, PCB layout constraints, design for manufacturability, hardware bring-up, and design validation.
  • Experience with PCIe, 10GE, DDR4, SPI, I2C, USB, and UART interfaces.
  • Strong knowledge of signal integrity, power integrity, DC/DC switching power supplies, and PoE PSE/PD.
  • Proficiency with OrCAD, Allegro, Arena, and Microsoft Office.
  • Experience with compliance and regulatory testing, laboratory equipment, logic analyzers, oscilloscopes, Sifos PoE testers, and thermal chambers.

Nice to have

  • Basic knowledge of RF and antenna systems.
  • Familiarity with Qualcomm or Broadcom Wi-Fi SoCs.
  • Experience managing third-party component sourcing, design, and design reviews.
  • Experience with ODM, JDM, and contract manufacturing environments.

Culture & Benefits

  • Hybrid and remote work practices where feasible.
  • Health, dental, and vision insurance, disability coverage, and life insurance.
  • HSA/FSA options and matching retirement plans.
  • Paid vacation, parental leave, and paid volunteer leave.
  • Training opportunities, professional development, and employee stock purchase plan.

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