Senior Director, Dry Etch Development Engineering (Semiconductor)

Location: Hybrid work model with on-site presence at an hirify.global site in the United States; primary location Hillsboro, Oregon, with additional locations in Phoenix, Arizona, and Santa Clara, California.

Annual salary: $248,400–$350,690 USD.

Company

hirify.global is transforming its integrated device manufacturing business into a leading foundry service provider through advanced manufacturing, process development, and customer engineering.

What you will do

• Lead module development engineering teams delivering dry etch technology development, enablement, integrated process solutions, and feasibility studies.
• Oversee process and equipment performance, module improvements, manufacturing capacity growth, and technology transfers to high-volume manufacturing sites.
• Align integration, device, yield, and other engineering organizations around process solutions that improve power, performance, area, structural cost, quality, and safety.
• Partner with supplier executive management to identify and implement innovative manufacturing solutions.
• Lead reverse engineering, repair, and process improvement initiatives that increase cost efficiency, output, and yield.
• Hire, coach, and develop engineering teams while establishing long-term module engineering capability strategies.

Requirements

• Senior management experience in a large multinational manufacturing organization, preferably in high technology, scientific, or semiconductor technology development.
• Extensive semiconductor process development and leadership experience, including dry etch expertise across multiple equipment platforms.
• Experience optimizing and customizing solutions with investors and third-party suppliers.
• Global engineering leadership experience, including major factory ramp-ups and process technology development in high-volume manufacturing.
• Extensive fab start-up experience across manufacturing engineering, quality and reliability, research and development, and sourcing or supply chain innovation.
• Master’s degree in Electrical Engineering or a technical equivalent and 14 years of relevant semiconductor industry experience.

Nice to have

• Technical expertise in logic technology development, packaging, silicon process technologies, or related fields, supported by research and patents.
• Experience delivering customized solutions in R&D and high-volume manufacturing organizations.
• Experience in a semiconductor foundry environment.

Culture & Benefits

• Hybrid work model combining on-site work at an assigned hirify.global site with off-site work.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Collaborative environment focused on developing engineering capabilities and delivering team results.
• This is a Position of Trust requiring consent to and successful completion of an extended background investigation.