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2 дня назад

Director, Process Support Engineering (Semiconductor Manufacturing)

180 000 - 247 500$
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Director, Process Support Engineering (Semiconductor Manufacturing): Leading process support engineering teams and customer engagements for advanced memory R&D and high-volume semiconductor manufacturing with an accent on process integration, yield, defectivity, and next-generation technology adoption. Focus on developing engineering organizations, resolving complex customer escalations, aligning technology roadmaps, and driving operational execution across cross-functional teams.

Location: Boise, Idaho, United States

Salary: $180,000.00–$247,500.00 per year

Company

hirify.global develops and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.

What you will do

  • Lead a team of Process Support Engineering managers and engineers supporting a strategic semiconductor customer.
  • Build trusted relationships with senior customer engineering and manufacturing leaders and serve as the primary technical interface.
  • Drive technology demonstrations, evaluations, qualifications, joint development activities, and adoption of next-generation solutions.
  • Guide complex problem-solving involving yield, defectivity, productivity, process integration, and equipment performance.
  • Coordinate support strategies across Business Units, Account Sales, R&D, Product Engineering, Manufacturing, and Service organizations.
  • Manage resource planning, organizational growth, financial forecasting, performance indicators, and operational improvement.

Requirements

  • BS degree in Engineering, Physics, Materials Science, Chemistry, or a related technical discipline.
  • 10+ years of semiconductor industry experience and 5+ years leading technical teams or engineering organizations.
  • Experience supporting advanced semiconductor manufacturing environments and strong knowledge of process integration.
  • Proven customer-facing leadership experience, including technical escalations and complex problem-solving.
  • Outstanding communication and executive presentation skills.
  • Willingness to travel approximately 25% of the time.

Nice to have

  • Advanced degree such as an MS or PhD.
  • Experience with memory technologies, including DRAM, and major semiconductor manufacturers.
  • Multidisciplinary knowledge of deposition, etch, CMP, metrology, inspection, or patterning.
  • Experience developing engineering managers and technical leaders.

Culture & Benefits

  • Supportive environment focused on learning, professional development, and career growth.
  • Health and wellbeing programs and a comprehensive benefits package.
  • Potential eligibility for bonus compensation and stock awards.
  • Relocation eligible.
  • Culture emphasizing accountability, innovation, collaboration, customer focus, and continuous improvement.

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