Principal Engineer-TD Foundry Engineering (Semiconductor Manufacturing)

Location: Hybrid role based at an assigned hirify.global site in the United States; primary location in Hillsboro, Oregon, with additional locations in Phoenix, Arizona; Folsom and Santa Clara, California; and Austin, Texas.

Annual salary range: $220,920–$311,890 USD.

Company

hirify.global is a semiconductor manufacturer developing process technologies, integrated manufacturing, packaging, testing, and supply chain capabilities.

What you will do

• Set strategic yield and performance governance, roadmaps, and process-control standards for foundry customer products.
• Lead initiatives addressing systematic and parametric yield losses across process integration, device engineering, and defect metrology.
• Oversee predictive AI/ML modeling, metric correlation, device-performance analysis, and complex DOE and skew-split strategies.
• Direct NPI execution from design tape-out and pre-silicon evaluation through silicon qualification, HVM transition, and volume ramp.
• Drive PDK strategy, Sil2Sim correlation, layout-effect assessment, waiver governance, design rules, and mask tape-out execution.
• Act as the executive technical liaison for foundry customers, senior management, and C-suite stakeholders while resolving critical technical blockers.

Requirements

• Master’s degree with 13+ years of experience or PhD with 10+ years of industry experience.
• Degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related engineering or physical science discipline.
• Relevant experience in semiconductor integration, device engineering, or yield engineering.
• Extensive experience in semiconductor yield and performance analysis, process integration, product data interpretation, and long-term engineering roadmaps.
• Experience leading foundry teams or high-level foundry customer collaborations, including work with fabless design houses.
• Executive-level customer orientation and knowledge of inline inspection, e-test, and SORT programs.

Culture & Benefits

• Collaborative environment focused on semiconductor technology innovation and large-scale manufacturing.
• Hybrid work model combining on-site work at an assigned hirify.global site with off-site work.
• Compensation package includes competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Role is a Position of Trust and requires consent to and successful completion of an extended background investigation.
• Shift 1 schedule in the United States of America.