EDA Tools Software Engineer (Semiconductor)

TL;DR

EDA Tools Software Engineer (Semiconductor): Designing and developing software tools, flows, and methodologies for hardware design automation with an accent on reliability verification, extraction, and simulation. Focus on automating build and deployment, performing end-to-end testing, and optimizing semiconductor design rules.

Location: Hybrid (USA: Phoenix, AZ; Folsom, CA; San Jose, CA)

Salary: $149,600 - $284,580 USD

Company

hirify.global Foundry provides state-of-the-art semiconductor manufacturing and packaging technology to enable leadership products for the AI era.

What you will do

• Design, develop, and debug software tools, flows, and methodologies used in design automation.
• Capture user stories and requirements to write functional and test code.
• Automate build and deployment processes for software tools.
• Perform unit, integration, and end-to-end testing of the development pipeline.
• Implement methodologies to optimize Product PPAC (Performance, Power, Area, Cost).

Requirements

• Master's degree in Electrical Engineering, Computer Engineering, or a related engineering field.
• 10+ years of experience in electrical/software engineering and tool optimization.
• In-depth knowledge of semiconductor device physics, process technology, and design rules.
• Experience with EM (Electromigration), IR drop, and ESD concepts for design methodologies.
• Proficiency in scripting languages such as SKILL, Python, PERL, or TCL.
• Must be based in the US to support the hybrid work model.

Nice to have

• Experience with physical verification flows, specifically LVS and DRC.
• Ability to apply AI/ML techniques for analog layout generation and automation.
• Expertise in applying ML to geometry and graph-based problems.
• Experience leading cross-functional and industry-wide initiatives.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Hybrid work model allowing a split between on-site and off-site work.
• Opportunity to work on cutting-edge silicon process and packaging technology.