Manufacturing Process Development Engineer-Wafer Cleaving Operation

Location: USA — Greensboro, North Carolina

Salary: $89,650–$166,000 USD annually

Company

Work on semiconductor and advanced manufacturing processes for edge-emitting laser components.

What you will do

• Develop and sustain wafer cleaving, singulation, and facet coating preparation processes for thinned wafers.
• Establish and maintain process specifications, statistical process control standards, FMEAs, and OCAPs.
• Develop and sustain pick-and-place equipment processes and bar stacking and unstacking for facet processing.
• Provide real-time engineering support for thinning operations in high-volume manufacturing.
• Lead responses to process excursions, tool issues, and product-at-risk situations using structured problem-solving methods.
• Investigate yield losses, defects, and reliability issues, implementing corrective and preventive actions.

Requirements

• Bachelor’s or master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related discipline.
• 5+ years of industrial experience supporting semiconductor or advanced manufacturing processes.
• Experience with semiconductor wafer fabrication and wafer die singulation.
• Experience with pick-and-place equipment and die-handling practices.
• Familiarity with automation, advanced process control, SPC, DOE, and statistical analysis.
• Proficiency with JMP, Excel, SQL, Python, or similar data tools, along with strong technical communication and documentation skills.

Culture & Benefits

• Full-time employment in a manufacturing engineering environment.
• Work alongside passionate, customer-focused professionals.
• Equal opportunity workplace with reasonable accommodations available during hiring and employment.