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Process and Integration Engineer, Optoelectronics

109 700 - 175 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process and Integration Engineer, Optoelectronics (Thin-Film Deposition/Semiconductor Manufacturing): Developing, optimizing, and scaling multilayer AR, HR, and passivation coatings for microelectronic laser and detector products with an accent on Ion Beam Sputtering, process control, and manufacturing yield. Focus on designing experiments, solving coating and process defects through root-cause analysis, qualifying equipment upgrades, and managing process performance across internal and subcontractor facilities.

Location: 100% onsite in Breinigsville, Pennsylvania, USA, in a 24/7 manufacturing environment.

Annual base salary: $109,700–$175,500, plus discretionary annual bonus and equity opportunities.

Company

hirify.global designs, develops, and supplies semiconductor and infrastructure software solutions, including optoelectronic lasers and detectors manufactured at its Breinigsville facility.

What you will do

  • Lead the development, optimization, and scaling of multilayer AR, HR, and passivation coatings using Ion Beam Sputtering.
  • Design and execute DOE studies to improve productivity, yield, quality, reliability, and batch-process efficiency.
  • Provide technical leadership for facet coating and backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection.
  • Manage equipment lifecycles, including requirements definition, engineering upgrades, qualification, and buyoff.
  • Implement process control plans, SPC, FMEA, OCAP, metrology, root-cause analysis, and CAPA.
  • Collaborate with Product, Quality, R&D, and external foundry teams while monitoring subcontractor performance and reporting KPIs.

Requirements

  • Master’s degree in Materials Science, Optical Engineering, Chemical Engineering, or Electrical Engineering.
  • At least 6 years of semiconductor manufacturing experience, including 4 years of hands-on thin-film deposition experience for optoelectronic devices.
  • Knowledge of vacuum physics, IBS, ALD, and dielectric coating materials such as Al2O3, SiO2, Ta2O5, TiO2, and Si3N4.
  • Experience with SPC, DOE, FMEA, DMAIC, statistical data analysis, JMP, SQL, and Tableau.
  • Experience with automated bar handling, wafer scribing and cleaving, Pick-and-Place, AVI tools, burn-in, and mechanical engineering fundamentals.
  • Excellent written and verbal communication, detailed problem-solving skills, and a proactive, action-oriented approach.

Nice to have

  • Ph.D. in Materials Science, Optical Engineering, Chemical Engineering, or Electrical Engineering.
  • Practical knowledge of Lean manufacturing methodologies.

Culture & Benefits

  • Onsite work in a high-volume, 24/7 optoelectronics manufacturing facility.
  • Medical, dental, and vision insurance plans.
  • 401(k) participation with company matching and an Employee Stock Purchase Program.
  • Company-paid holidays, paid sick leave, vacation time, and applicable paid family leave.
  • Employee Assistance Program, annual bonus eligibility, and new-hire and annual equity award opportunities.

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