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Process and Integration Engineer, Optoelectronics

91 100 - 146 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process and Integration Engineer, Optoelectronics (Thin-Film Deposition/Semiconductor Manufacturing): Developing, optimizing, and scaling multilayer AR, HR, and passivation coatings for microelectronic laser and detector products with an accent on Ion Beam Sputtering, process control, and manufacturing yield. Focus on designing experiments, solving coating and process defects through root-cause analysis, qualifying equipment upgrades, and managing process performance across internal and subcontractor facilities.

Location: 100% on-site in Breinigsville, Pennsylvania, USA, in a 24/7 manufacturing environment

Annual base salary: USD 91,100–146,000

Company

hirify.global designs, develops, and supplies semiconductor and infrastructure software solutions, including optoelectronic products for telecommunications and datacenter customers.

What you will do

  • Lead the development, optimization, and scaling of multilayer AR, HR, and passivation coatings using Ion Beam Sputtering.
  • Design and execute Design of Experiments to improve batch processes, productivity, yield, quality, and reliability.
  • Provide technical leadership for facet coating and backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection.
  • Manage equipment lifecycles, tool requirements, engineering upgrades, qualification, and buyoff.
  • Implement process control plans, SPC, FMEA, OCAP, metrology, root-cause analysis, and CAPA.
  • Collaborate with Product, Quality, R&D, and external foundry teams while monitoring subcontractor performance and reporting KPIs.

Requirements

  • Master’s degree in Materials Science, Optical Engineering, Chemical Engineering, or Electrical Engineering.
  • At least 3 years of semiconductor manufacturing experience, including 1 year of hands-on thin-film deposition for optoelectronic devices.
  • Knowledge of vacuum physics, IBS, ALD, and dielectric coating materials such as Al2O3, SiO2, Ta2O5, TiO2, and Si3N4.
  • Experience with statistical data analysis, SPC, DOE, FMEA, DMAIC, JMP, SQL, and Tableau.
  • Experience with automated bar handling, wafer scribing and cleaving, Pick-and-Place, AVI tools, burn-in, and mechanical engineering fundamentals.
  • Strong written and verbal communication, detail-oriented problem-solving, and a proactive approach.

Nice to have

  • Ph.D. in Materials Science, Optical Engineering, Chemical Engineering, or Electrical Engineering.
  • Practical knowledge of Lean manufacturing methodologies.

Culture & Benefits

  • Work in a high-volume, 24/7 optoelectronics manufacturing facility.
  • Collaborate with internal teams, subcontractors, and external foundries across regions.
  • Discretionary annual bonus and new-hire and annual equity awards.
  • Medical, dental, and vision plans, 401(k) with company matching, and ESPP.
  • Paid holidays, sick leave, vacation, family leave, and an Employee Assistance Program.

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