ATD Laser Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $85,200–$162,500 USD

Company

hirify.global develops semiconductor technologies and packaging solutions for advanced computing products.

What you will do

• Design and develop laser assembly packaging processes and equipment for next-generation semiconductor packaging.
• Optimize manufacturing processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Develop process and equipment specifications using Design of Experiments and data analysis.
• Manage packaging process flows, procedures, physical layout manufacturability, and laser process specifications.
• Collaborate with suppliers and cross-functional engineering teams to establish quality standards and deliver critical milestones.
• Develop quality screens, qualification procedures, and reliability requirements to identify and prevent packaging issues.

Requirements

• Bachelor’s or master’s degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field.
• Proficiency in Statistical Process Control and Design of Experiments principles.
• Fundamental understanding of laser and optical systems.
• Experience or academic background relevant to manufacturing, process development, or engineering research.
• Ability to work on-site in Phoenix, Arizona, United States.

Nice to have

• Hands-on experience in technology manufacturing, semiconductor packaging, or troubleshooting laser-based equipment and systems.
• Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.
• Experience applying Python, NumPy/Pandas, SQL, JMP, or Minitab to large and complex datasets.
• Experience collaborating on time-sensitive, cross-functional engineering projects.

Culture & Benefits

• Full-time, first-shift position.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonus opportunities.
• Work focused on semiconductor packaging innovation and manufacturing technology.