ATD Laser Development Engineer (Laser Assembly)

Location: Phoenix, Arizona, United States; on-site presence required

Annual salary: $85,200–$162,500 USD

Company

hirify.global develops semiconductor technologies and packaging solutions for advanced computing products.

What you will do

• Design and develop laser assembly packaging processes and equipment for next-generation semiconductor packaging.
• Optimize manufacturing processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Develop process and equipment specifications using Design of Experiments and data analysis.
• Manage packaging process flows, procedures, physical layout manufacturability, and laser process specifications.
• Collaborate with suppliers and cross-functional engineering teams to meet quality standards and technical milestones.
• Develop process techniques, quality screens, and reliability requirements to identify and prevent packaging issues.

Requirements

• Bachelor’s or master’s degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field.
• Proficiency in Statistical Process Control and Design of Experiments principles.
• Fundamental understanding of laser and optical systems.
• Ability to work on-site in Phoenix, Arizona, United States.
• Experience with data science and statistics tools such as Python, NumPy/Pandas, SQL, JMP, or Minitab.

Nice to have

• Hands-on experience in technology manufacturing or semiconductor packaging.
• Experience troubleshooting laser-based equipment and systems.
• Familiarity with equipment adjustment, process characterization, and electronics assembly manufacturability.
• Experience collaborating with cross-functional teams on time-sensitive projects.

Culture & Benefits

• Competitive pay and stock bonuses.
• Health, retirement, and vacation benefits.
• Focus on responsible business practices and ethical hiring.