Module Development Engineer (Semiconductor)

Location: Onsite in Hillsboro, Oregon, United States

Salary: $115,110–$162,500 annual USD

Company

hirify.global develops semiconductor technologies and operates high-volume manufacturing and technology development programs.

What you will do

• Develop, integrate, optimize, and sustain advanced semiconductor manufacturing processes for current production and future device architectures.
• Select materials, optimize process parameters, define metrology strategies, qualify equipment, and support system integration.
• Design experiments, feasibility studies, simulations, and characterization activities to evaluate processes, equipment, and material interactions.
• Define and validate integrated Module Target Specifications, FMEAs, Control Plans, and change-management processes.
• Investigate manufacturing excursions, yield detractors, and quality issues using statistical, data-driven, and model-based methods.
• Lead cross-functional process improvements, new product introductions, equipment and materials qualification, and technology ramp activities.

Requirements

• Bachelor’s degree in a related STEM discipline with 3+ years of industry experience, or a master’s degree with 2+ years of experience, or a PhD in a related STEM discipline.
• Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Proficiency in Statistical Process Control and Design of Experiments principles.
• Programming experience in Python or MATLAB.
• Hands-on experience with robotics, automation systems, vision systems, and image processing.
• Regular onsite presence in Hillsboro, Oregon is required.

Nice to have

• Experience troubleshooting manufacturing processes and equipment.
• Experience with packaging processes, equipment automation development, and project management in technology development.

Culture & Benefits

• Competitive pay with stock bonuses.
• Health, retirement, and vacation benefits.
• Cross-functional collaboration with fabrication operations, suppliers, materials teams, packaging teams, and external partners.
• Opportunities to contribute to semiconductor technology roadmaps and high-volume manufacturing innovations.