3 дня назад
Principal Thermal and Thermo-Mechanical Simulation Engineer (AI)
20 - 45€
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Principal Thermal and Thermo-Mechanical Simulation Engineer (AI): Validating semiconductor package and device designs with thermal and thermo-mechanical simulations on an AI-powered hardware design platform with an accent on thermal physics, continuum mechanics, warpage, stress, and reliability. Focus on leading customer simulations at imec, demonstrating advanced semiconductor workflows, guiding engineering teams, and translating technical feedback into product improvements.
Location: Onsite at IMEC in Leuven, Belgium several days per week; remote collaboration with teams in Palo Alto, California. Moderate travel within continental Europe and occasional intercontinental travel are required.
Compensation: €20–€45, L4–L7+, based on experience.
Company
develops physics AI software that helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems.
What you will do
- Act as the senior technical authority for thermal and thermo-mechanical simulation at imec, defining methodologies, best practices, and mentoring engineers.
- Set up simulations, run test cases, and interpret results for advanced semiconductor devices, electronics packages, and wafer-scale systems.
- Evaluate steady-state and transient thermal behavior, nonlinear mechanics, contact interactions, warpage, stress evolution, and reliability.
- Partner with sales on product demonstrations, proof-of-concept evaluations, technical discussions, training sessions, and workshops across Europe.
- Identify workflow gaps and translate customer feedback into actionable product and engineering improvements.
- Represent at semiconductor conferences and maintain awareness of competing simulation technologies and industry trends.
Requirements
- Degree in Mechanical, Electrical, or a related engineering field.
- 15+ years of hands-on experience in thermal management, mechanical warpage, stress, and reliability analysis.
- Experience with semiconductor electronics packaging, advanced packaging, or foundry technologies, including chip and wafer warpage and 2.5D/3D ICs.
- Experience with commercial simulation software such as Flowtherm, Cadence, Ansys, Abaqus, or LS-DYNA.
- Scripting experience with Python or C++ and strong problem-solving, communication, and interpersonal skills.
- Prior leadership or managerial experience and experience in customer-facing engineering or pre-sales roles.
Nice to have
- Experience commercializing technical software, particularly EDA or simulation tools, for semiconductor and electronics companies.
- Ability to rapidly learn physics-based workflows and AI-assisted design tools.
Culture & Benefits
- Work at the intersection of AI, advanced engineering, and customer success.
- Help define the future of AI for hardware design.
- Collaborate with engineers and researchers in a fast-moving startup environment.
- Work remotely with sales, product, and engineering teams while maintaining an onsite presence at IMEC.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →
Похожие вакансии
2 дня назад
Software Engineer (Textile Composite Modeling)
3 дня назад
Thermal-Structural Analyst
115 000 - 150 000$
5 дней назад
Senior SW Safety Engineer (Autonomous Vehicles)
160 000 - 180 000$
20 часов назад
Virtual Analysis Engineer (BIW Manufacturing)
3 дня назад
PV Product Engineering Lead (AI)
208 000 - 263 000$
2 дня назад
Principal Software Engineer (Nonlinear FEA)
117 600 - 218 400$