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3 дня назад

Principal Thermal and Thermo-Mechanical Simulation Engineer (AI)

20 - 45
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US/Belgium
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal Thermal and Thermo-Mechanical Simulation Engineer (AI): Validating semiconductor package and device designs with thermal and thermo-mechanical simulations on an AI-powered hardware design platform with an accent on thermal physics, continuum mechanics, warpage, stress, and reliability. Focus on leading customer simulations at imec, demonstrating advanced semiconductor workflows, guiding engineering teams, and translating technical feedback into product improvements.

Location: Onsite at IMEC in Leuven, Belgium several days per week; remote collaboration with teams in Palo Alto, California. Moderate travel within continental Europe and occasional intercontinental travel are required.

Compensation: €20–€45, L4–L7+, based on experience.

Company

hirify.global develops physics AI software that helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems.

What you will do

  • Act as the senior technical authority for thermal and thermo-mechanical simulation at imec, defining methodologies, best practices, and mentoring engineers.
  • Set up simulations, run test cases, and interpret results for advanced semiconductor devices, electronics packages, and wafer-scale systems.
  • Evaluate steady-state and transient thermal behavior, nonlinear mechanics, contact interactions, warpage, stress evolution, and reliability.
  • Partner with sales on product demonstrations, proof-of-concept evaluations, technical discussions, training sessions, and workshops across Europe.
  • Identify workflow gaps and translate customer feedback into actionable product and engineering improvements.
  • Represent hirify.global at semiconductor conferences and maintain awareness of competing simulation technologies and industry trends.

Requirements

  • Degree in Mechanical, Electrical, or a related engineering field.
  • 15+ years of hands-on experience in thermal management, mechanical warpage, stress, and reliability analysis.
  • Experience with semiconductor electronics packaging, advanced packaging, or foundry technologies, including chip and wafer warpage and 2.5D/3D ICs.
  • Experience with commercial simulation software such as Flowtherm, Cadence, Ansys, Abaqus, or LS-DYNA.
  • Scripting experience with Python or C++ and strong problem-solving, communication, and interpersonal skills.
  • Prior leadership or managerial experience and experience in customer-facing engineering or pre-sales roles.

Nice to have

  • Experience commercializing technical software, particularly EDA or simulation tools, for semiconductor and electronics companies.
  • Ability to rapidly learn physics-based workflows and AI-assisted design tools.

Culture & Benefits

  • Work at the intersection of AI, advanced engineering, and customer success.
  • Help define the future of AI for hardware design.
  • Collaborate with engineers and researchers in a fast-moving startup environment.
  • Work remotely with sales, product, and engineering teams while maintaining an onsite presence at IMEC.

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