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4 дня назад

Memory/Advanced Packaging Strategy Technologist (Semiconductor)

148 000 - 203 500$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Memory/Advanced Packaging Strategy Technologist (Semiconductor): Developing technology roadmaps and strategic analysis for memory and advanced packaging solutions with an accent on DRAM, NAND, process integration, device physics, and market forecasting. Focus on translating technology inflections into process equipment requirements, supporting integrated demonstrations, protecting integration solutions through IP, and analyzing customer and competitor strategies.

Location: Gloucester, MA, United States. Relocation eligible; travel required up to 20% of the time.

Salary: $148,000–$203,500 per year, with potential bonus and stock award eligibility.

Company

hirify.global develops materials science and engineering solutions for semiconductor chips, advanced displays, and related electronics applications.

What you will do

  • Develop memory technology roadmaps and strategic plans for the Varian Business Unit.
  • Identify future technology challenges in memory and advanced packaging with marketing, technical, and engineering stakeholders.
  • Translate memory technology inflections into process equipment requirements and support integrated demonstrations and business-unit integration.
  • Analyze customer and competitor strategies, end-user trends, market demand, investment plans, technology adoption, and penetration opportunities.
  • Support market sizing, forecasting, nodal sizing, and market share analysis.
  • Prepare technical, marketing, executive, and external presentation materials and file intellectual property for integration solutions.

Requirements

  • Excellent understanding of memory technologies, including DRAM and NAND.
  • Knowledge of process integration and device physics.
  • At least 5 years of semiconductor processing experience as a lead process integration engineer or device engineer working on leading-edge technology.
  • Advanced degree such as an M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
  • Strong presentation, data analysis, communication, collaboration, and stakeholder-influencing skills.
  • Ability to solve unique, complex problems and lead projects with notable risk and complexity.

Nice to have

  • Understanding of advanced packaging processes and integration schemes.
  • Knowledge of AI applications for engineering process optimization.

Culture & Benefits

  • Supportive environment focused on learning, development, and career growth.
  • Comprehensive benefits supporting employee health and wellbeing.
  • Potential eligibility for bonus and stock award programs.
  • Regular collaboration with internal and external customers and stakeholders.

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