Memory/Advanced Packaging Strategy Technologist (Semiconductor)

Location: Gloucester, Massachusetts, United States; onsite role. Travel required 20% of the time. Relocation eligible.

Salary: $148,000–$203,500 per year, plus potential bonus and stock award participation.

Company

hirify.global develops materials science, engineering, and semiconductor equipment solutions for advanced chips and displays.

What you will do

• Support the memory technology roadmap and strategy for the Varian Business Unit, covering memory and advanced packaging applications.
• Identify future technology challenges, inflections, pathfinding activities, and implications for process equipment over the next 10 years.
• Translate memory technology changes into process equipment requirements and provide integrated demonstration and integration support.
• Analyze customer and competitor strategies, market demand, technology adoption, customer investment plans, market share, and penetration opportunities.
• Develop technical and marketing collateral, executive presentations, forecasts, market sizing analyses, and updates for internal, corporate, and external audiences.
• Write and file intellectual property protecting developed integration solutions and collaborate with marketing, technical, engineering, business-unit, and external stakeholders.

Requirements

• At least 5 years of experience in semiconductor processing as a lead process integration engineer or device engineer working on leading-edge technology.
• Excellent understanding of memory technologies, including DRAM and NAND, as well as process integration and device physics.
• Advanced degree such as an M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
• Excellent presentation, data analysis, and communication skills.
• Ability to work effectively with all organizational levels and functional areas.
• Ability to anticipate business and regulatory issues and recommend product, process, or service improvements.
• Ability to lead projects with notable risk and complexity, develop project execution strategy, solve unique and complex problems, and influence senior stakeholders.

Nice to have

• Good understanding of advanced packaging processes and integration schemes.
• Knowledge of effective AI applications for engineering process optimization.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Comprehensive employee benefits supporting health and wellbeing.
• Potential eligibility for bonus and stock award programs.
• Equal opportunity employment and accessibility support during the application process.