Director PostFab Engineering (Advanced Packaging)

Location: Essex Junction, United States

Salary: $166,500–$290,000 per year, determined based on qualifications, experience, and location.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

• Lead the advanced packaging development organization across package architecture, assembly processes, qualification, manufacturing readiness, and product industrialization.
• Define and maintain technology roadmaps for silicon photonics, optical interconnects, co-packaged optics, AI networking, and future platforms.
• Drive technology decisions involving package design, materials, thermal management, reliability, manufacturability, cost, and production scale-up.
• Serve as the primary technical and business interface to OSATs, assembly partners, material suppliers, customers, and ecosystem collaborators.
• Lead cross-functional execution across design, process integration, reliability, product engineering, manufacturing, quality, procurement, and supply chain.
• Communicate program status, investment recommendations, risks, and strategic priorities to senior leadership.

Requirements

• BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline.
• 15+ years of experience in semiconductor packaging, advanced packaging, photonics packaging, or related technologies.
• Experience leading complex technology development organizations and multidisciplinary engineering teams.
• Strong knowledge of flip-chip assembly, wafer-level packaging, optical packaging, high-density interconnects, thermal management, and reliability qualification.
• Experience working with OSATs, outsourced manufacturing partners, and semiconductor supply chains, plus strategic customer and external partner engagement.
• The role may require obtaining a U.S. Department of Defense Security Clearance; citizenship and background information may be reviewed to assess eligibility.

Nice to have

• Experience with silicon photonics, optical engines, optical interconnects, or co-packaged optics.
• Experience supporting hyperscale, networking, telecommunications, AI, or datacenter applications.
• Experience building and scaling high-performing engineering organizations.
• Experience managing technology roadmaps, strategic investments, and customer-facing development programs.

Culture & Benefits

• Opportunity to enable future silicon photonics products and advanced packaging solutions.
• Cross-functional work with engineering, manufacturing, quality, procurement, supply chain, customers, and external partners.
• Commitment to environmental, health, safety, and security requirements.
• Equal-opportunity workplace with a stated commitment to cultural diversity.
• Employment is subject to applicable pre-employment conditions, laws, and regulations.