5 дней назад
Substrate Supplier Enablement Engineer (Advanced Packaging)
140 830 - 198 820$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Substrate Supplier Enablement Engineer (Advanced Packaging): Developing and qualifying supplier capabilities for high-density FCBGA, EMIB-T, and glass core substrate technologies with an accent on process integration, factory readiness, and yield improvement. Focus on managing supplier qualification, validating new manufacturing capacity, and coordinating complex production ramps across US and East Asian partners.
Location: On-site in Phoenix, Arizona, United States, with periodic meetings with suppliers in East Asia, stakeholders in the US, and occasional travel to supplier sites.
Salary: $140,830–$198,820 annual salary.
Company
is a semiconductor technology company developing advanced computing and packaging solutions.
What you will do
- Lead substrate supplier development and qualification for advanced packaging technologies.
- Collaborate with supplier and internal engineering teams on component embedding, core fabrication, laser drilling, lamination, lithography, plating, inspection, metrology, and electrical testing.
- Manage supplier readiness milestones, Product Control System commitments, and critical process interactions.
- Design and implement factory technology validation and product certification plans focused on yield improvement.
- Develop factory startup schedules and align suppliers with key production milestones.
- Monitor ramp indicators and enable incident-free production ramps and new capacity introductions.
Requirements
- Bachelor’s degree with 6+ years of experience, Master’s degree with 4+ years, or PhD with 2+ years in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related field.
- Experience with statistical tools and methods, including Statistical Process Control, for yield improvement.
- Experience managing complex projects and delivering results in high-volume manufacturing environments.
- Experience with packaging, substrates, or semiconductor manufacturing.
- Experience with process flow development, FMEA, DOE design, or structured problem-solving tools.
- Availability for on-site work in Phoenix and periodic travel or meetings involving East Asian suppliers is required.
Nice to have
- Leadership experience in supplier management or technology enablement.
- Experience driving alignment and execution across global teams.
- Knowledge of advanced packaging technologies and substrate or assembly manufacturing methodologies.
- Ability to deliver results in high-ambiguity, high-pressure environments.
Culture & Benefits
- On-site work model with Shift 1 scheduling in the United States.
- Competitive compensation with stock bonuses.
- Health, retirement, and vacation benefits.
- Commitment to responsible business practices and ethical hiring.
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