Substrate Supplier Enablement Engineer (Advanced Packaging)

Location: On-site in Phoenix, Arizona, United States; periodic meetings with suppliers in East Asia and stakeholders in the United States, with occasional travel to supplier sites.

Annual salary: $120,860–$198,820 USD.

Company

hirify.global develops advanced semiconductor packaging and manufacturing technologies for customer products.

What you will do

• Lead substrate supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrate technologies.
• Collaborate with suppliers and engineering teams on component embedding, core fabrication, laser drilling, dielectric lamination, lithography, metal plating, inspection, metrology, and electrical testing.
• Advance substrate building-block technologies and manage critical process interactions with supplier engineering teams.
• Drive Product Control System commitments, factory technology validation, and product certification plans focused on yield improvement.
• Develop micro schedules for new factory startups and align suppliers with readiness milestones.
• Monitor qualification activities and ramp indicators to support incident-free production ramps and new capacity introduction.

Requirements

• Bachelor's degree with 6+ years of experience, Master's degree with 4+ years, or PhD with 2+ years in mechanical engineering, materials science, chemical engineering, electrical engineering, physics, or a related technical field.
• Experience with statistical tools and methods, including Statistical Process Control (SPC) for yield improvement.
• Experience managing complex projects and delivering results in high-volume manufacturing environments.
• Experience with packaging, substrates, or semiconductor manufacturing.
• Experience with process flow development, FMEA, DOE design, or structured problem-solving tools.
• Ability to work on-site in Phoenix, Arizona, United States, with occasional supplier-site travel.

Nice to have

• Leadership experience in supplier management or technology enablement.
• Experience driving alignment and execution across global teams.
• Knowledge of advanced packaging technologies and substrate or assembly manufacturing methodologies.
• Ability to deliver results in high-ambiguity environments and under pressure.

Culture & Benefits

• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Commitment to responsible business practices and ethical hiring.
• No recruitment, medical examination, or other hiring fees are charged to candidates.