17 часов назад
Advanced Packaging Analyst
160 000 - 170 000CAD
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Advanced Packaging Analyst (Semiconductor Packaging): Building advanced packaging process flows and technical reports from device structure, layout, material, and reverse engineering analysis with an accent on hybrid bonding, fan-out, 2.5D/3D integration, and interposer fabrication. Focus on measuring critical dimensions, interpreting SEM/TEM/EDS/EELS/FIB results, comparing foundry and OSAT technologies, and explaining emerging heterogeneous integration trends.
Location: Ottawa, ON, Canada; 5 days in-office
Salary: $160,000–$170,000 CAD annually
Company
provides semiconductor industry intelligence through reverse engineering, teardowns, process analysis, market research, forecasts, and technical commentary.
What you will do
- Build process flows for advanced packaging structures, including hybrid bonding, fan-out, 2.5D/3D integration, and interposer fabrication.
- Measure critical dimensions such as TSVs, bump pitch, interposer features, and substrate layers.
- Annotate reverse-engineering images and write technical reports for customers.
- Compare analysis results across generations and between foundries and OSATs.
- Write technical blogs, record video briefings, and answer customer questions about published reports.
- Collaborate with analysts and project teams on technology trends, process and materials analysis, and documentation.
Requirements
- Bachelor’s or master’s degree in physics, electrical engineering, materials science, or a related field.
- 5+ years of industry experience in advanced packaging unit processes at a foundry or OSAT.
- Strong knowledge of advanced packaging structures, materials, and integration schemes.
- Experience interpreting SEM, TEM, EDS, EELS, and FIB analysis results.
- Strong analytical skills and the ability to work across multiple information sources.
- Excellent oral, written, communication, and presentation skills.
Nice to have
- Knowledge of wafer probing and package final test processes and hardware.
- Familiarity with silicon photonics and co-packaged optics, including optical engine assembly, PIC/EIC integration, and optical coupling.
Culture & Benefits
- Company-sponsored training and development opportunities.
- Comprehensive health, dental, vision, wellness, RRSP/401K matching, and annual fitness reimbursement benefits.
- Flexible vacation policy and device reimbursement program.
- Wellness resources, charitable community involvement, and an inclusive environment focused on diversity, equity, and accessibility.
- AI technology may assist with application screening and assessment, with recruiter involvement throughout the process.
Hiring process
- Submit current citizenship and/or permanent residency information to support compliance with U.S. Export Control Laws and Regulations.
- Accommodations are available on request throughout the selection process.
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