Назад
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17 часов назад

Advanced Packaging Analyst

160 000 - 170 000CAD
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Canada
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Advanced Packaging Analyst (Semiconductor Packaging): Building advanced packaging process flows and technical reports from device structure, layout, material, and reverse engineering analysis with an accent on hybrid bonding, fan-out, 2.5D/3D integration, and interposer fabrication. Focus on measuring critical dimensions, interpreting SEM/TEM/EDS/EELS/FIB results, comparing foundry and OSAT technologies, and explaining emerging heterogeneous integration trends.

Location: Ottawa, ON, Canada; 5 days in-office

Salary: $160,000–$170,000 CAD annually

Company

hirify.global provides semiconductor industry intelligence through reverse engineering, teardowns, process analysis, market research, forecasts, and technical commentary.

What you will do

  • Build process flows for advanced packaging structures, including hybrid bonding, fan-out, 2.5D/3D integration, and interposer fabrication.
  • Measure critical dimensions such as TSVs, bump pitch, interposer features, and substrate layers.
  • Annotate reverse-engineering images and write technical reports for customers.
  • Compare analysis results across generations and between foundries and OSATs.
  • Write technical blogs, record video briefings, and answer customer questions about published reports.
  • Collaborate with analysts and project teams on technology trends, process and materials analysis, and documentation.

Requirements

  • Bachelor’s or master’s degree in physics, electrical engineering, materials science, or a related field.
  • 5+ years of industry experience in advanced packaging unit processes at a foundry or OSAT.
  • Strong knowledge of advanced packaging structures, materials, and integration schemes.
  • Experience interpreting SEM, TEM, EDS, EELS, and FIB analysis results.
  • Strong analytical skills and the ability to work across multiple information sources.
  • Excellent oral, written, communication, and presentation skills.

Nice to have

  • Knowledge of wafer probing and package final test processes and hardware.
  • Familiarity with silicon photonics and co-packaged optics, including optical engine assembly, PIC/EIC integration, and optical coupling.

Culture & Benefits

  • Company-sponsored training and development opportunities.
  • Comprehensive health, dental, vision, wellness, RRSP/401K matching, and annual fitness reimbursement benefits.
  • Flexible vacation policy and device reimbursement program.
  • Wellness resources, charitable community involvement, and an inclusive environment focused on diversity, equity, and accessibility.
  • AI technology may assist with application screening and assessment, with recruiter involvement throughout the process.

Hiring process

  • Submit current citizenship and/or permanent residency information to support compliance with U.S. Export Control Laws and Regulations.
  • Accommodations are available on request throughout the selection process.

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