Senior Technologist (Hybrid Bonding)

TL;DR

Senior Technologist (Hybrid Bonding): Driving process and equipment development for next-generation die-to-wafer hybrid bonding technologies with an accent on yield, reliability, and operational efficiency. Focus on leading first-of-a-kind platform development, optimizing bond interface quality, and establishing robust process control strategies for high-performance computing and AI architectures.

Location: On-site in Hillsboro, Oregon, USA

Salary: $180,770–$255,200 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovation in silicon process and advanced packaging technology for the AI era.

What you will do

• Drive process and equipment development for die-to-wafer hybrid bonding, including material selection and parameter optimization.
• Design and execute DOE-based experiments to establish robust process windows and control strategies.
• Lead first-of-a-kind process and equipment capability development for new bonding platforms.
• Optimize manufacturing processes to improve yield, reliability, and defectivity performance.
• Collaborate with technology development, process integration, and manufacturing teams to drive process maturity.
• Partner with equipment and materials vendors to develop enabling process and hardware solutions.

Requirements

• Bachelor's degree with 9+ years, Master's with 6+ years, or PhD with 4+ years of experience in a relevant engineering or scientific field.
• 5+ years of industry experience in hybrid bonding, wafer bonding, or advanced packaging.
• Demonstrated ability to solve complex technical problems using structured engineering methodologies.
• Strong written and verbal communication skills for presenting technical findings.
• Proven ability to mentor and develop engineers and technical team members.
• Must be able to work on-site in Hillsboro, Oregon.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work on cutting-edge semiconductor technology for high-performance computing and AI.
• Collaborative environment focused on continuous improvement and innovation.