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8 часов назад

Silicon Packaging Design Engineer (Semiconductors)

105 650 - 200 340$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Silicon Packaging Design Engineer (Semiconductors): Driving the end-to-end development of silicon interposer and bridge designs with an accent on physical layout, routing, and system-level optimization. Focus on utilizing EDA tools to resolve DRCs and optimizing package performance for manufacturability and cost.

Location: On-site presence required in Phoenix, AZ or Hillsboro, OR, USA

Salary: $105,650 - $200,340 USD

Company

hirify.global is a global leader in semiconductor manufacturing and packaging technology, focusing on cutting-edge silicon processes for the AI era.

What you will do

  • Design and implement physical layout and routing of silicon interposers and embedded bridges.
  • Perform substrate fit and routing studies to evaluate tradeoffs in performance, cost, and manufacturability.
  • Collaborate with silicon, technology development, and hardware teams to optimize silicon-package-board integration.
  • Analyze design data and resolve design rule checks (DRCs) to achieve optimized package designs.
  • Utilize EDA tools including Virtuoso, Innovus, FusionCompiler, ICvalidator, and Calibre.
  • Document processes and design specifications within the product lifecycle management system.

Requirements

  • Bachelor's degree with 3+ years of experience OR Master's degree with 2+ years of experience in Electrical Engineering, Computer Engineering, or a STEM field.
  • Proficiency in custom layout and Auto-place-and-route EDA tools (Virtuoso, Innovus, FusionCompiler, ICvalidator, and/or Calibre).
  • Experience with silicon physical layout design, development, and routing interconnects.
  • Specialized experience in at least one area: Analog/Mixed Signal fundamentals, Power Distribution/Integrity, or reliability requirements for interconnects.
  • Must be based in the USA and able to work on-site.

Culture & Benefits

  • Competitive pay and stock bonuses.
  • Comprehensive health and retirement benefit programs.
  • Paid vacation and industry-leading total compensation package.
  • Opportunity to work on world-changing technology in a fast-paced environment.

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