Foveros Direct Pathfinding Integration (Semiconductor Packaging)

TL;DR

Foveros Direct Pathfinding Integration (Semiconductor Packaging): Designing and qualifying packaging solutions and materials for semiconductor products with an accent on thermal, mechanical, and electrical design concepts. Focus on managing the packaging development process, integrating hybrid bonding, and optimizing supply chain efficiency.

Location: Must be based on-site in Hillsboro, Oregon or Phoenix, Arizona, US

Salary: $141,910.00 - $269,100.00 USD

Company

hirify.global Foundry focuses on state-of-the-art semiconductor manufacturing and advanced packaging technology for the AI era.

What you will do

• Apply scientific and engineering principles to design, develop, and qualify packaging solutions and materials.
• Manage the entire packaging development process, including artwork, prototypes, qualification testing, and specification documentation.
• Coordinate with manufacturing, regulatory, logistics, and supply chain partners to optimize efficiency and reduce waste.
• Consult cross-organizational partners on product launch, branding, marketing, and bills of material requirements.
• Implement processes to drive cost reduction and sustainability in the packaging supply chain.

Requirements

• Bachelor's degree in Engineering, Materials Science, Chemistry, Physics, or related field with 6+ years of experience (or Master's/PhD with 4+ years).
• Experience in packaging engineering, process development, and technology innovation.
• Knowledge of thermal, mechanical, and electrical design concepts related to semiconductor packaging.
• Expertise in qualification testing, specification documentation, and packaging material certification.
• On-site presence required in the US (Oregon or Arizona).

Nice to have

• Experience in Hybrid Bonding Process development or Integration.
• Background in advanced packaging technology development and strategic supplier management.
• Experience leading technology programs and engaging with cross-functional stakeholders.
• Participation in industry forums or task forces driving defect reduction and process improvements.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive benefit programs including health insurance, retirement, and vacation.
• Opportunity to work on industry-leading semiconductor innovations shaping the future of technology.
• Commitment to ethical hiring practices and Responsible Business Alliance (RBA) compliance.