Foveros Direct Pathfinding Integration (Semiconductor Packaging)

Location: On-site in Hillsboro, Oregon, United States, with an additional location in Phoenix, Arizona, United States

Annual salary: $141,910–$269,100 USD

Company

Intel Foundry develops semiconductor process and packaging technologies, supporting global manufacturing, supply chain operations, and advanced device assembly and testing.

What you will do

• Apply scientific and engineering principles to design, develop, and qualify semiconductor packaging solutions and materials.
• Manage packaging development from artwork, concepts, and prototypes through qualification testing, documentation, manufacturing startup, and benchmarking.
• Coordinate with manufacturing, regulatory, logistics, supply chain, and vendor partners.
• Improve packaging efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and supply chain performance.
• Support product launches, branding, SKU management, barcodes, labeling, bills of materials, and regulatory compliance for product shipments.

Requirements

• Bachelor’s degree in engineering, Materials Science, Chemistry, Physics, or a related field with 6+ years of relevant experience; or a master’s degree with 4+ years; or a PhD with 4+ years.
• Experience in packaging engineering, process development, and technology innovation.
• Experience with thermal, mechanical, and electrical design concepts for semiconductor packaging.
• Expertise in qualification testing, specification documentation, and packaging material certification.
• Ability to work on-site in the United States.

Nice to have

• Advanced packaging technology development and strategic supplier management experience.
• Hybrid bonding process development or integration experience.
• Experience leading technology programs and engaging cross-functional stakeholders.
• Participation in forums, task forces, or working groups focused on defect reduction and process improvement.

Culture & Benefits

• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Work within a worldwide factory network focused on semiconductor manufacturing and advanced packaging.
• Shift 1 schedule in the United States.