Process Engineer, Advanced Packaging

Location: Santa Clara, California, United States. Relocation eligible; travel required up to 10% of the time.

Salary: $124,000–$171,000 per year

Company

hirify.global develops and services materials engineering equipment used in semiconductor and advanced display manufacturing.

What you will do

• Design, collect data from, analyze, and report on complex process engineering experiments.
• Perform hardware characterization on a variety of systems and measure film properties.
• Troubleshoot process engineering issues, conduct root cause analysis, and implement solutions.
• Generate product documentation, presentations, and technical reports.
• Communicate with customers to resolve complex process engineering concerns.
• Select and collaborate with vendors and suppliers, implement new technologies and instrumentation, and support junior colleagues and project teams.

Requirements

• Bachelor’s or master’s degree in electrical, chemical, or mechanical engineering, materials science, physics, or a related field.
• 4–7 years of related experience.
• Strong analytical and data analysis skills with demonstrated complex problem-solving expertise.
• Familiarity with electronic device packaging and W2W/D2W bonding.
• Excellent communication and teamwork skills, with the ability to work independently and manage multiple tasks.
• Attention to detail and a proactive approach to problem-solving.

Nice to have

• Hands-on experience with W2W and D2W bonding fabrication.
• Experience operating tools and developing processes in the PCB or semiconductor industry.
• Advanced degree in a related field.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Comprehensive employee benefits supporting health and wellbeing.
• Potential eligibility for bonus and stock award programs.
• Regular employment with full-time status.