Process Engineer Intern (Semiconductor)

Location: Singapore, SGP. Relocation eligible: No.

Company

hirify.global develops and services materials science and engineering solutions for semiconductor chips and advanced displays.

What you will do

• Design and execute process engineering experiments for thin film deposition.
• Support the development and optimization of CVD, PECVD, PEALD, and related processes.
• Perform wafer processing, experimental runs, and film characterization on internal test vehicles.
• Collect and analyze process and metrology data, using statistical methods and visualization tools to identify trends.
• Troubleshoot process and equipment issues, participate in root cause analysis, and propose corrective actions.
• Document experiments, prepare technical reports and presentations, and collaborate with process, hardware, manufacturing, and product engineering teams.

Requirements

• Knowledge of semiconductor manufacturing processes.
• Basic understanding of thin film deposition, plasma processing, or surface science.
• Experience with experimental design and data analysis.
• Strong problem-solving and analytical skills.
• Effective verbal and written communication skills.
• Ability to work independently and collaboratively in a team environment.

Nice to have

• Experience with low-temperature dielectric deposition, advanced packaging materials, wafer bonding, gap fill, process hardware characterization, process automation, data analytics, or AI-assisted process optimization.

Culture & Benefits

• Full-time internship with hands-on exposure to semiconductor manufacturing equipment and process development methodologies.
• Supportive environment focused on learning, professional development, and career growth.
• Opportunities to collaborate with engineering teams on customer-focused technology development.
• Health and wellbeing programs and employee support resources.
• No travel required.