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2 дня назад

Etch Process Engineer E3S (Semiconductor)

124 000 - 171 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Мэтч & Сопровод

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Описание вакансии

Текст:
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TL;DR
Etch Process Engineer E3S (Semiconductor): Designing, executing, and analyzing plasma etch experiments for semiconductor process development with an accent on profile control, selectivity, critical dimension, defectivity, and uniformity. Focus on characterizing etch chamber hardware, analyzing thin-film properties, troubleshooting process issues, and qualifying new processes and hardware for development and production.

Location: Santa Clara, CA, United States; onsite

Salary: $124,000–$171,000 per year

Company

hirify.global develops materials science and engineering solutions and semiconductor manufacturing equipment used in advanced chips and displays.

What you will do

  • Design, execute, analyze, and document routine to moderately complex plasma etch experiments.
  • Investigate etch process challenges and develop experiments focused on profile control, selectivity, critical dimension, defectivity, and uniformity.
  • Characterize etch chamber hardware and process conditions, including ESCs, rings, liners, gas delivery systems, and RF subsystems.
  • Troubleshoot process issues, perform root cause analysis, and implement corrective actions with guidance from experienced engineers.
  • Measure thin-film and post-etch material properties using established metrology methods.
  • Collaborate with hardware, mechanical, manufacturing, center-of-excellence, and customer-facing teams while supporting process and hardware qualification.

Requirements

  • Master’s degree or foreign equivalent in Materials Science, Chemistry, Physics, Chemical Engineering, Electrical Engineering, or a related field.
  • Typically 2–5 years of semiconductor process engineering experience, preferably in plasma etch.
  • Fundamental knowledge of plasma chemistry, surface interactions, and etch process parameter relationships.
  • Working knowledge of etch chamber subsystems and controls, including RF power, gas delivery, pressure, temperature, and hardware configuration.
  • Familiarity with thin-film characterization techniques such as SEM, XRD, XPS, and post-etch analysis.
  • Basic proficiency in Design of Experiments, statistical analysis, process data interpretation, and technical communication.

Nice to have

  • Experience with semiconductor process development, characterization, or manufacturing environments.
  • Experience with plasma etch process development.

Culture & Benefits

  • Supportive work culture focused on learning, development, and career growth.
  • Comprehensive benefits package supporting employee health and wellbeing.
  • Potential eligibility for bonus and stock award programs, as applicable.
  • Travel is required for approximately 10% of the time.
  • Relocation is not eligible for this position.

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