Dry Etch Module Development Engineer (Semiconductor)

TL;DR

Dry Etch Module Development Engineer (Semiconductor): Developing and optimizing next-generation patterning processes and dry etch technology for high-volume manufacturing with an accent on plasma-surface interactions and process architecture. Focus on driving yield improvements, designing complex DOE experiments, and implementing robust control systems for advanced technology nodes.

Location: Hybrid (Must be based in Hillsboro, Oregon, US)

Salary: $133,800–$255,200 USD

Company

hirify.global is a global leader in semiconductor design and manufacturing, developing groundbreaking technologies for the future of computing.

What you will do

• Drive technology development for high-volume manufacturing and future technology roadmaps.
• Own the development of next-generation patterning processes, including architecture and optimization.
• Perform pathfinding activities on existing and first-of-kind equipment to enable innovative device architectures.
• Provide technical leadership for cross-functional problem solving to resolve complex process and defect issues.
• Design and execute comprehensive characterization plans and DOE studies.
• Establish and mature control systems (SPC, recipe governance) to optimize production performance.

Requirements

• PhD with 4+ years, Master's with 6+ years, or Bachelor's with 8+ years of industry experience in dry etch at a leading foundry or equipment supplier.
• Hands-on experience in semiconductor manufacturing and dry etch process optimization.
• Strong command of plasma etch fundamentals, including plasma generation and profile control.
• Expertise in statistical analysis and DOE methodologies using JMP, Python, or MATLAB.
• Must be able to maintain regular onsite presence in Hillsboro, Oregon.

Nice to have

• Experience with ICP/CCP plasma etch, HARC, ALE, or Vapor phase isotropic etching.
• Strong understanding of logic BEOL interconnects and their etch integration requirements.
• Proficiency in material characterization techniques such as SEM, TEM, AFM, or XPS.
• Evidence of technical influence through patents, publications, or recognized subject matter expertise.

Culture & Benefits

• Competitive compensation package including pay and stock bonuses.
• Comprehensive benefit programs covering health, retirement, and vacation.
• Hybrid work model allowing employees to split time between on-site and off-site work.