обновлено 5 дней назад
Director, Process Engineer – Dry Etch (Semiconductor Manufacturing)
211 400 - 298 440$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Director, Process Engineer – Dry Etch (Semiconductor Manufacturing): Leading the development, optimization, transfer, and sustaining of dry etch processes across advanced CMOS technologies with an accent on plasma processing, process capability, manufacturability, yield, and defect reduction. Focus on designing experiments, resolving equipment and process issues, enabling high-volume manufacturing, and coordinating integrated solutions with factory, engineering, metrology, and supplier teams.
Location: Hybrid work model with on-site work at sites in Hillsboro, Oregon or Phoenix, Arizona, United States.
Annual salary: $211,400–$298,440 USD
Company
Foundry develops and manufactures advanced semiconductor technologies, including process and packaging solutions, for customers worldwide.
What you will do
- Lead dry etch process engineering across advanced CMOS technology development, transfer, optimization, and sustaining.
- Improve process capability, profile control, critical dimension uniformity, selectivity, defectivity, yield, throughput, and cost.
- Define and execute process experiments, analyze metrology and inline data, identify root causes, and implement corrective actions.
- Enable high-volume manufacturing through process transfer, ramp readiness, tool qualification, recipe optimization, and excursion response.
- Resolve tool, chamber matching, hardware, and productivity issues with equipment suppliers.
- Coordinate with technology development, manufacturing, integration, lithography, thin films, cleans, yield, defect metrology, quality, reliability, and supplier teams.
Requirements
- 10+ years of relevant semiconductor industry experience focused on dry etch process development, process integration, or high-volume manufacturing support.
- Master's degree in electrical engineering, chemical engineering, mechanical engineering, materials science, physics, chemistry, or a related technical field.
- Hands-on experience with dry etch process development, plasma etch equipment, recipe optimization, process characterization, and troubleshooting.
- Experience collaborating across process modules, integration, equipment engineering, manufacturing, yield, defect metrology, and external suppliers.
- Ability to work in a dynamic fab environment, handle urgent manufacturing issues, and drive technical closure under schedule pressure.
Nice to have
- Doctoral degree in a related technical field.
- Experience with advanced CMOS, Gate-All-Around technology, advanced patterning, atomic layer etch, conductor or dielectric etch, spacer etch, or hard mask open.
- Experience in semiconductor foundry, logic technology development, or high-volume manufacturing environments.
- Experience with statistical process control, design of experiments, structured problem solving, and metrology or inspection data such as CD-SEM, profile, defect, overlay, electrical test, or yield data.
Culture & Benefits
- In-person collaboration is expected to support rapid decision-making and problem resolution.
- Hybrid work model allowing employees to split time between the assigned site and off-site work.
- Competitive pay, bonuses, stock awards, discounted stock purchase opportunities, health and retirement benefits, vacation, wellness programs, and life and disability insurance.
- The role is a Position of Trust and requires passing an extended background investigation.
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